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74LV139D,118
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
74L
V139_4
© NXP B.V
. 2007. All rights reserved.
Product data sheet
Rev
. 04 — 13 December 2007
10 of 16
NXP Semiconductors
74L
V139
Dual 2-to-4 line decoder/demultiple
xer
Fig 10.
P
ackage outline SO
T109-1 (SO16)
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT109-1
99-12-27
03-02-19
076E07
MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.39
0.38
0.16
0.15
0.05
1.05
0.041
0.244
0.228
0.028
0.020
0.028
0.012
0.01
0.25
0.01
0.004
0.039
0.016
0
2.5
5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
74L
V139_4
© NXP B.V
. 2007. All rights reserved.
Product data sheet
Rev
. 04 — 13 December 2007
11 of 16
NXP Semiconductors
74L
V139
Dual 2-to-4 line decoder/demultiple
xer
Fig 11.
P
ackage outline SO
T338-1 (SSOP16)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
0.65
1.25
7.9
7.6
1.03
0.63
0.9
0.7
1.00
0.55
8
0
o
o
0.13
0.2
0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT338-1
99-12-27
03-02-19
(1)
w
M
b
p
D
H
E
E
Z
e
c
v
M
A
X
A
y
1
8
16
9
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
MO-150
pin 1 index
0
2.5
5 mm
scale
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
A
max.
2
74L
V139_4
© NXP B.V
. 2007. All rights reserved.
Product data sheet
Rev
. 04 — 13 December 2007
12 of 16
NXP Semiconductors
74L
V139
Dual 2-to-4 line decoder/demultiple
xer
Fig 12.
P
ackage outline SO
T403-1 (TSSOP16)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.40
0.06
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT403-1
MO-153
99-12-27
03-02-18
w
M
b
p
D
Z
e
0.25
18
16
9
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
A
max.
1.1
pin 1 index
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
74LV139D,118
Mfr. #:
Buy 74LV139D,118
Manufacturer:
NXP Semiconductors
Description:
Encoders, Decoders, Multiplexers & Demultiplexers DUAL 2-4 LINE
Lifecycle:
New from this manufacturer.
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