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MCT0603MD1000BP100

P1-P3P4-P6P7-P9P10-P10
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
www.vishay.com
Vishay Beyschlag
Revision: 21-Feb-17
7
Document Number: 28785
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
4.23
Climatic sequence:
Standard operation mode
± (0.25 % R + 0.02 )
4.23.2 2 (Bb) Dry heat 125 °C; 16 h
4.23.3 30 (Db) Damp heat, cyclic
55 °C; 24 h; 90 % RH;
1 cycle
4.23.4 1 (Ab) Cold -55 °C; 2 h
4.23.5 13 (M) Low air pressure 8.5 kPa; 2 h; (25 ± 10) °C
4.23.6 30 (Db) Damp heat, cyclic
55 °C; 24 h; 90 % RH;
5 cycles
4.23.7 - DC load U = U
max.
; 1 min
-1 (Aa)
Storage at low
temperature
-55 °C; 2 h ± (0.05 % R + 0.01 )
4.19 14 (Na)
Rapid change of
temperature
30 min at -55 °C and
30 min at 155 °C;
1000 cycles
± (0.25 % R + 0.02 )
Extended rapid change
of temperature
30 min at -40 °C;
30 min at 125 °C
(3)
;
MCS 0402 AT: 3000 cycles
MCT 0603 AT: 2000 cycles
MCU 0805 AT: 1500 cycles
MCA 1206 AT: 1000 cycles
± (0.25 % R + 0.05 );
( 50 % of initial shear force)
4.13 -
Short time overload:
Standard operation mode
U = 2.5 x or
U = 2 × U
max.
;
whichever is the less severe;
5 s
± (0.05 % R + 0.01 )
4.27 -
Single pulse high
voltage overload:
Standard operation mode
Severity no. 4:
U = 10 x or
U = 2 x U
max.
;
whichever is the less severe;
10 pulses 10 μs/700 μs
± (0.25 % R + 0.05)
4.39 -
Periodic electric
overload:
Standard operation mode
U = or
U = 2 x U
max.
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
± (0.5 % R + 0.05)
4.38 -
Electro static discharge
(human body model)
IEC 61340-3-1
(1)
;
3 pos. + 3 neg.
(equivalent to MIL-STD-883,
method 3015)
MCS 0402 AT: 500 V
MCT 0603 AT: 1000 V
MCU 0805 AT: 1500 V
MCA 1206 AT: 2000 V
± (0.5 % R + 0.05)
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
(1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.25 OR BETTER
(2)
Stability for product types:
MCS 0402 AT 47 to 221 k
MCT 0603 AT 47 to 511 k
MCU 0805 AT 47 to 1 M
MCA 1206 AT 47 to 1 M
P
70
x R
P
70
x R
P
70
x R
15 x P
70
x R
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
www.vishay.com
Vishay Beyschlag
Revision: 21-Feb-17
8
Document Number: 28785
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Notes
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2)
According to the detail specification EN 140401-801 the stability class applies to the category temperatures 85 °C and 125 °C and their
respective test conditions.
(3)
Tested on a 4-layer printed circuit board with SAC micro alloy.
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or
200 m/s
2
; 7.5 h
± (0.05 % R + 0.01)
no visible damage
4.17 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning (95 % covered);
no visible damage
4.18 58 (Td)
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
± (0.05 % R + 0.01)
4.29 45 (XA)
Component solvent
resistance
Isopropyl alcohol +50 °C;
method 2
No visible damage
4.32 21 (Ue
3
) Shear (adhesion)
MCS 0402 AT and
MCT 0603 AT; 9 N
No visible damage
MCU 0805 AT and
MCA 1206 AT; 45 N
4.33 21 (Ue
1
) Substrate bending Depth 2 mm, 3 times
± (0.05 % R + 0.01)
no visible damage;
no open circuit in bent position
4.7 - Voltage proof U
RMS
= U
ins
; (60 ± 5) s No flashover or breakdown
4.35 - Flammability
IEC 60695-11-5
(1)
,
needle flame test; 10 s
No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
(1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.25 OR BETTER
(2)
Stability for product types:
MCS 0402 AT 47 to 221 k
MCT 0603 AT 47 to 511 k
MCU 0805 AT 47 to 1 M
MCA 1206 AT 47 to 1 M
MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
www.vishay.com
Vishay Beyschlag
Revision: 21-Feb-17
9
Document Number: 28785
For technical questions, contact: thinfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DIMENSIONS
SOLDER PAD DIMENSIONS
Notes
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x
(1)
,
or in publication IPC-7351.
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
DIMENSIONS AND MASS
TYPE / SIZE
H
(mm)
L
(mm)
W
(mm)
W
T
(mm)
T
t
(mm)
T
b
(mm)
MASS
(mg)
MCS 0402 AT 0.32 ± 0.05 1.0 ± 0.05 0.5 ± 0.05 > 75 % of W 0.2 + 0.1/- 0.15 0.2 ± 0.1 0.6
MCT 0603 AT 0.45 + 0.1/- 0.05 1.55 ± 0.05 0.85 ± 0.1 > 75 % of W 0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2 1.9
MCU 0805 AT 0.52 ± 0.1 2.0 ± 0.1 1.25 ± 0.15 > 75 % of W 0.4 + 0.1/- 0.2 0.4 + 0.1/- 0.2 4.6
MCA 1206 AT 0.55 ± 0.1 3.2 + 0.1/- 0.2 1.6 ± 0.15 > 75 % of W 0.5 ± 0.25 0.5 ± 0.25 9.2
RECOMMENDED SOLDER PAD DIMENSIONS
TYPE / SIZE
WAVE SOLDERING REFLOW SOLDERING
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
G
(mm)
Y
(mm)
X
(mm)
Z
(mm)
MCS 0402 AT - - - - 0.35 0.55 0.55 1.45
MCT 0603 AT 0.55 1.10 1.10 2.75 0.65 0.70 0.95 2.05
MCU 0805 AT 0.80 1.25 1.50 3.30 0.90 0.90 1.40 2.70
MCA 1206 AT 1.40 1.50 1.90 4.40 1.50 1.15 1.75 3.80
T
b
T
t
L
H
W
W
T
P1-P3P4-P6P7-P9P10-P10

MCT0603MD1000BP100

Mfr. #:
Buy MCT0603MD1000BP100
Manufacturer:
Vishay
Description:
Thin Film Resistors - SMD .125W 100ohms 0.1% 0603 SMD 25ppm
Lifecycle:
New from this manufacturer.
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