Philips Semiconductors Product data sheet
NE1619HECETA4 Temperature and voltage monitor
2
2004 Oct 05
GENERAL DESCRIPTION
The NE1619 is designed for monitoring the temperatures and supply
voltages of microprocessor-based systems by measuring those
parameters and comparing the readings with programmable limits.
The device provides five possible analog inputs, a remote
temperature sensor input and on-board local temperature sensor.
The device also monitors its own power supply and provides digital
inputs for the Pentium/PRO power supply ID code.
The device communicates with the system controller via an SMBus
(System Management bus) by which it can be programmed for
operation and data collection. Readings come from conversions of
the on-board A-to-D converter which cycles through all
measurements in sequence in approximately one second when the
conversion is started. The device includes a number of registers to
store data of the device configuration, status, readings and limits.
Except for the temperature-related data which are in 8-bit digital
2’s complement format, all the data are in 8-bit digital straight format.
FEATURES
• Monitor local and remote temperatures
• Temperature accuracy of ±2 °C for local, and ±3 °C for remote
channel
• Temperature resolution of 1 °C
• 2.8 V to 5.5 V supply range
• Monitor different power supplies: 12 V, 5 V, 3.3 V, 2.5 V, V
CCP,
V
DD
• V
IN
accuracy of ±2% of full scale
• Differential non-linearity of ±1LSB
• No calibration required
• Programmable temperature and voltage limits for alarms
• Programmable Reset low state pulse output
• SMBus 2-wire serial interface
• Small 16-lead SSOP (QSOP) package
• Compatible with Intel “Heceta 4” specification and reference
designs utilizing it
• ESD protection exceeds 2000 V HBM per JESD22-A114,
250 V MM per JESD22-A115 and 1000 V CDM per JESD22-C101
• Latch-up testing is done to JESDEC Standard JESD78 which
exceeds 100 mA
APPLICATIONS
• System thermal and hardware monitor
• Desktop computers
• Notebook computers
• Industrial controllers
• Telecom equipment
ORDERING INFORMATION
T
amb
= 0
°
C to +125
°
C
Type number Topside mark
Package
Name Description Version
NE1619DS NE1619 SSOP16
(QSOP)
plastic shrink small outline package; 16 leads; body width 3.9 mm;
lead pitch 0.635 mm
SOT519-1
Standard packing quantities and other packaging data are available at www.standardproducts.philips.com/packaging.
