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NBXDPA019LNHTAG

P1-P3P4-P6P7-P8
© Semiconductor Components Industries, LLC, 2010
March, 2010 − Rev. 2
1 Publication Order Number:
NBXDPA019/D
NBXDPA019
2.5 V / 3.3 V, 125 MHz /
250MHz LVDS Clock
Oscillator
The NBXDPA019 dual frequency crystal oscillator (XO) is
designed to meet today’s requirements for 2.5 V and 3.3 V LVDS
clock generation applications. The device uses a high Q fundamental
crystal and Phase Lock Loop (PLL) multiplier to provide selectable
125 MHz or 250 MHz, ultra low jitter and phase noise LVDS
differential output.
This device is a member of ON Semiconductor’s PureEdget clock
family that provides accurate and precision clock solutions.
Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape
and reel in quantities of 1000.
Features
• LVDS Differential Output
• Uses High Q Fundamental Mode Crystal and PLL Multiplier
• Ultra Low Jitter and Phase Noise − 0.5 ps (12 kHz − 20 MHz)
• Selectable Output Frequency − 125 MHz (default) / 250 MHz
• Hermetically Sealed Ceramic SMD Package
• Operating Range: 2.5 V ±5%
Operating Range: 3.3 V ±10%
• Total Frequency Stability − $50 ppm
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Ethernet, Gigabit Ethernet
• Infiniband
• Base Stations
Figure 1. Simplified Logic Diagram
PLL
Clock
Multiplier
Crystal
GNDFSELOE
CLK CLKV
DD
654
123
http://onsemi.com
MARKING DIAGRAM
NBXDPA019 = NBXDPA019 (±50 PPM)
125.00/250.00 = Output Frequency (MHz)
AA = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb−Free Package
6 PIN CLCC
LN SUFFIX
CASE 848AB
NBXDPA019
125.00/250.00
AAWLYYWWG
Device Package Shipping
†
ORDERING INFORMATION
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
NBXDPA019LN1TAG CLCC−6
(Pb−Free)
1000/
Tape & Reel
NBXDPA019LNHTAG CLCC−6
(Pb−Free)
100/
Tape & Reel
6 PIN CLCC
LU SUFFIX
CASE 848AC
NBXDPA019
125.00/250.00
AAWLYYWWG
*Contact factory for availability.
NBXDPA019LU1TAG* CLCC−6
(Pb−Free)
1000/
Tape & Reel
NBXDPA019LUHTAG* CLCC−6
(Pb−Free)
100/
Tape & Reel
NBXDPA019
http://onsemi.com
2
FSEL
OE
GND
CLK
V
DD
CLK
1
2
3
6
5
4
Figure 2. Pin Connections (Top View)
Table 1. PIN DESCRIPTION
Pin No. Symbol I/O Description
1 OE LVTTL/LVCMOS
Control Input
Output Enable Pin. When left floating pin defaults to logic HIGH and output is active.
See OE pin description Table 2.
2 FSEL LVTTL/LVCMOS
Control Input
Output Frequency Select Pin. Pin will default to logic HIGH when left open. See Output
Frequency Select pin description Table 3.
3 GND Power Supply Ground 0 V
4 CLK LVDS Output
Non−Inverted Clock Output. Typically loaded with 100 W receiver termination resistor
across differential pair.
5 CLK LVDS Output
Inverted Clock Output. Typically loaded with 100 W receiver termination resistor across
differential pair.
6 V
DD
Power Supply Positive power supply voltage. Voltage should not exceed 2.5 V ±5% or 3.3 V ±10%.
Table 2. OUTPUT ENABLE TRI−STATE FUNCTION
OE Pin Output Pins
Open Active
HIGH Level Active
LOW Level High Z
Table 3. OUTPUT FREQUENCY SELECT
FSEL Pin Output Frequency (MHz)
Open
(pin will float high)
125
HIGH Level 125
LOW Level 250
Table 4. ATTRIBUTES
Characteristic Value
Input Default State Resistor
170 kW
ESD Protection Human Body Model
Machine Model
2 kV
200 V
Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test
1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
Table 5. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Units
V
DD
Positive Power Supply GND = 0 V 4.6 V
I
out
LVDS Output Current Continuous
Surge
25
50
mA
T
A
Operating Temperature Range −40 to +85 °C
T
stg
Storage Temperature Range −55 to +120 °C
T
sol
Wave Solder See Figure 6 260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
NBXDPA019
http://onsemi.com
3
Table 6. DC CHARACTERISTICS (V
DD
= 2.5 V ± 5% or V
DD
= 3.3 V ± 10%, GND = 0 V, T
A
= −40°C to +85°C) (Note 2)
Symbol
Characteristic Conditions Min. Typ. Max. Units
I
DD
Power Supply Current 78 105 mA
V
IH
OE and FSEL Input HIGH Voltage 2000 V
DD
mV
V
IL
OE and FSEL Input LOW Voltage GND − 300 800 mV
I
IH
Input HIGH Current OE
FSEL
−100
−100
+100
+100
mA
I
IL
Input LOW Current OE
FSEL
−100
−100
+100
+100
mA
DV
OD
Change in Magnitude of V
OD
for
Complementary Output States
(Note 3)
0 1 25 mV
V
OS
Offset Voltage 1125 1375 mV
DV
OS
Change in Magnitude of V
OS
for
Complementary Output States
(Note 3)
0 1 25 mV
V
OH
Output HIGH Voltage V
DD
= 2.5 V
V
DD
= 3.3 V
1425 1600 mV
V
OL
Output LOW Voltage V
DD
= 2.5 V
V
DD
= 3.3 V
900 1075 mV
V
OD
Differential Output Voltage 250 450 mV
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Measurement taken with outputs terminated with 100 ohm across differential pair. See Figure 5.
3. Parameter guaranteed by design verification not tested in production.
P1-P3P4-P6P7-P8

NBXDPA019LNHTAG

Mfr. #:
Buy NBXDPA019LNHTAG
Manufacturer:
ON Semiconductor
Description:
Standard Clock Oscillators XO LVDS 125/250
Lifecycle:
New from this manufacturer.
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