NBXDPA019LNHTAG

NBXDPA019
http://onsemi.com
4
Table 7. AC CHARACTERISTICS (V
DD
= 2.5 V ± 5% or V
DD
= 3.3 V ± 10%, GND = 0 V, T
A
= 40°C to +85°C) (Note 4)
Symbol
Characteristic Conditions Min. Typ. Max. Units
f
CLKOUT
Output Clock Frequency
FSEL = HIGH 125
MHz
FSEL = LOW 250
Df
Frequency Stability NBXDPA019 (Note 5) ±50 ppm
F
NOISE
PhaseNoise Performance 100 Hz of Carrier 108/103 dBc/Hz
f
CLKout
= 125 MHz/250 MHz
(See Figures 3 and 4)
1 kHz of Carrier 122/11 6 dBc/Hz
10 kHz of Carrier 129/123 dBc/Hz
100 kHz of Carrier 129/124 dBc/Hz
1 MHz of Carrier 136/131 dBc/Hz
10 MHz of Carrier 159/156 dBc/Hz
t
jit
(F)
RMS Phase Jitter 12 kHz to 20 MHz 0.5 0.75 ps
t
jitter
Cycle to Cycle, RMS 1000 Cycles 4 8 ps
Cycle to Cycle, PeaktoPeak 1000 Cycles 17 35 ps
Period, RMS 10,000 Cycles 2 4 ps
Period, PeaktoPeak 10,000 Cycles 7 20 ps
t
OE/OD
Output Enable/Disable Time 200 ns
t
DUTY_CYCLE
Output Clock Duty Cycle
(Measured at Cross Point)
48 50 52 %
t
R
Output Rise Time (20% and 80%) 250 400 ps
t
F
Output Fall Time (80% and 20%) 250 400 ps
t
start
Startup Time 1 5 ms
Aging
1
st
Year 3 ppm
Every Year After 1
st
1 ppm
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
4. Measurement taken with outputs terminated with 100 ohm across differential pair. See Figure 5.
5. Parameter guarantees 10 years of aging. Includes initial stability at 25°C, shock, vibration and first year aging.
NBXDPA019
http://onsemi.com
5
Figure 3. Typical Phase Noise Plot at 125 MHz
Figure 4. Typical Phase Noise Plot at 250 MHz
NBXDPA019
http://onsemi.com
6
Table 8. RELIABILITY COMPLIANCE
Parameter Standard Method
Shock Mechanical MILSTD833, Method 2002, Condition B
Solderability Mechanical MILSTD833, Method 2003
Vibration Mechanical MILSTD833, Method 2007, Condition A
Solvent Resistance Mechanical MILSTD202, Method 215
Resistance to Soldering Heat Mechanical MILSTD203, Method 210, Condition I or J
Thermal Shock Environment MILSTD833, Method 1001, Condition A
Moisture Resistance Environment MILSTD833, Method 1004
Figure 5. Typical Termination for Output Driver and Device Evaluation
Driver
Device
Receiver
Device
CLK D
CLK D
Z
o
= 50 W
Z
o
= 50 W
100 W
NBXDPA019
260
217
175
150
Temperature (°C)
temp. 260°C
20 40 sec. max.
Time
60180 sec.
3°C/sec. max.
cooling
6°C/sec. max.
60150 sec.
reflow
peak
preheat
rampup
Figure 6. Recommended Reflow Soldering Profile

NBXDPA019LNHTAG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Standard Clock Oscillators XO LVDS 125/250
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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