Package Dimensions
Figure 5: 78-Ball FBGA Die Rev. A (package code TRF)
Seating plane
0.12 A
123789
Ball A1 Index
(covered by SR)
Ball A1 Index
A
0.25 MIN
1.1 ±0.1
6.4 CTR
9.5 ±0.1
0.8 TYP
9.6 CTR
11.5 ±0.1
78X Ø0.45
Dimensions apply
to solder balls
post-reflow
on Ø0.33 NSMD
ball pads.
0.8 TYP
A
B
C
D
E
F
G
H
J
K
L
M
N
Notes:
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-4000
www.micron.com/products/support Sales inquiries: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc. TwinDie is a trademark of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
8Gb: x4, x8 TwinDie DDR4 SDRAM
Package Dimensions
PDF: 09005aef8549206e
DDR4_8Gb_x4_x8_2CS_TwinDie.pdf - Rev. B 09/15 EN
13
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2015 Micron Technology, Inc. All rights reserved.
