CY62177EV30LL-55BAXIT

CY62177EV30 MoBL
®
Document Number: 001-09880 Rev. *N Page 16 of 18
Document History Page
Document Title: CY62177EV30 MoBL
®
, 32-Mbit (2 M × 16 / 4 M × 8) Static RAM
Document Number: 001-09880
Revision ECN
Orig. of
Change
Submission
Date
Description of Change
** 498562 NXR See ECN New data sheet.
*A 2544845 VKN /
PYRS
07/29/08 Removed 45 ns speed bin
Added 70 ns speed bin
Added 48-Pin TSOPI package
Added footnote# 4 related to TSOPI package
Added footnote# 9 related to I
SB2
and I
CCDR
Updated Ordering information table
*B 2589750 VKN /
PYRS
10/15/08 Changed pin functions of pin# 10 from NC to A20 and pin# 13 from A20 to DNU
in 48-Pin TSOPI package
*C 2668432 VKN /
PYRS
03/03/09 Replaced 70 ns speed with 55 ns
Extended the V
CC
range to 3.7 V
Changed I
CC (max)
spec from 2.8 mA to 4.5 mA at f = 1 MHz
Changed I
CC (max)
spec from 30 mA to 45 mA at f = f
(max)
Removed I
SB1
spec
Changed I
SB2 (max)
spec from 17 A to 25 A
Modified footnote #10
*D 2779867 VKN 10/06/09 Changed status from Preliminary to Final.
Changed I
CC (max)
spec from 4.5 mA to 5.5 mA at f = 1 MHz
Changed I
CC (typ)
spec from 2.2 mA to 4.5 mA at f = 1 MHz
Changed I
CC (typ)
spec from 28 mA to 35 mA at f = f
(max)
Added V
IL
spec for TSOP I package and footnote# 10
Changed C
OUT
spec from 10 pF to 15 pF
Included thermal specs
Changed t
OHA
spec from 10ns to 6ns
*E 2899662 AJU 03/26/10 Removed inactive parts from Ordering Information.
Updated Package Diagram
*F 2927528 VKN 05/04/2010 Included BHE
, BLE in footnote #11
Added footnote #25 related to chip enable
Added Contents and Acronyms
Updated links in Sales, Solutions, and Legal Information
*G 3177000 AJU 02/18/2011 Updated Features (Removed FBGA package related information).
Updated Pin Configurations (Removed FBGA package related information).
Corrected NC to DNU in footnote #2
Updated Electrical Characteristics (Included BHE
and BLE in I
SB2
test
conditions to reflect Byte power down feature).
Updated Thermal Resistance (Removed FBGA package related information).
Updated Data Retention Characteristics (Included BHE
and BLE in I
CCDR
test
conditions to reflect Byte power down feature).
Added Ordering Code Definitions.
Added Acronyms and Units of Measure.
Removed FBGA package related information in all instances in the document.
Updated in new template.
*H 3295175 RAME 06/29/2011 Updated Package Diagram.
Updated Table of Contents.
Removed reference to AN1064 SRAM system guidelines.
*I 3461953 TAVA 12/22/2011 Added Figure 2 and Figure 11.
Updated Ordering Information and Ordering Code Definitions.
Updated Thermal Resistance.
CY62177EV30 MoBL
®
Document Number: 001-09880 Rev. *N Page 17 of 18
*J 4100342 VINI 08/21/2013 Updated Switching Characteristics:
Added Note 17 and referred the same note in “Parameter” column.
Updated Package Diagram:
spec 51-85191 – Changed revision from *B to *C.
Updated to new template.
Completing Sunset Review.
*K 4111710 NILE 09/12/2013 Updated Electrical Characteristics:
Updated Note 10.
Updated Data Retention Characteristics:
Updated Note 13.
*L 4355423 MEMJ 04/29/2014 Updated Electrical Characteristics:
Updated Note 10 (Issue is fixed so pin A
20
can be left floating in standby).
Updated Switching Characteristics:
Added Note 22 and referred the same note in Write Cycle (for t
PWE
parameter
in WE
Controlled, OE LOW condition).
Updated Switching Waveforms:
Added Note 32 and referred the same note in Figure 10 (for t
PWE
parameter
in WE
Controlled, OE LOW condition).
*M 4567826 VINI 11/12/2014 Updated Features:
Included 48-ball FBGA package related information.
Updated Functional Description:
Added “For a complete list of related resources, click here.” at the end.
Updated Maximum Ratings:
Referred Notes 4, 5 in “Supply voltage to ground potential”.
Completing Sunset Review.
*N 5017414 VINI 11/17/2015 Updated Thermal Resistance:
Replaced “2-layer” with “four-layer” in “Test Conditions” column.
Changed value of
JA
parameter corresponding to TSOP I package from
44.66 C/W to 55.91 C/W.
Changed value of
JC
parameter corresponding to TSOP I package from
12.12 C/W to 9.39 C/W.
Updated Package Diagram:
spec 51-85183 – Changed revision from *C to *D.
Updated to new template.
Completing Sunset Review.
Document History Page (continued)
Document Title: CY62177EV30 MoBL
®
, 32-Mbit (2 M × 16 / 4 M × 8) Static RAM
Document Number: 001-09880
Revision ECN
Orig. of
Change
Submission
Date
Description of Change
Document Number: 001-09880 Rev. *N Revised November 17, 2015 Page 18 of 18
MoBL is a registered trademark, and More Battery Life is a trademark, of Cypress Semiconductor. All products and company names mentioned in this document may be the trademarks of their respective
holders.
CY62177EV30 MoBL
®
© Cypress Semiconductor Corporation, 2006-2015. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of
any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for
medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as
critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems
application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign),
United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of,
and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress
integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without
the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES
OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not
assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where
a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer
assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
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CY62177EV30LL-55BAXIT

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
SRAM 32Mb 3V 55ns 2M x 16 LP SRAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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