LT3976
27
3976f
For more information www.linear.com/3976
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
3.00 ±0.10
1.50 REF
5.00 ±0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ±0.10
23 24
1
2
BOTTOM VIEW—EXPOSED PAD
3.50 REF
0.75 ±0.05
R = 0.115
TYP
PIN 1 NOTCH
R = 0.20 OR 0.25
× 45° CHAMFER
0.25 ±0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UDD24) QFN 0808 REV Ø
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
0.25 ±0.05
3.50 REF
4.10 ±0.05
5.50 ±0.05
1.50 REF
2.10 ±0.05
3.50 ±0.05
PACKAGE OUTLINE
R = 0.05 TYP
1.65 ±0.10
3.65 ±0.10
1.65 ±0.05
24-Lead Plastic QFN (3mm × 5mm)
(Reference LTC DWG # 05-08-1833 Rev Ø)
3.65 ±0.05
0.50 BSC
