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CBT3126DB,112
P1-P3
P4-P6
P7-P9
P10-P12
P13-P13
CBT3126_4
© NXP B.V
. 2009. All rights reserved.
Product data sheet
Rev
. 04 — 12 October 2009
7 of 13
NXP Semiconductors
CBT3126
Quad FET bus s
witch
13.
P
acka
g
e outline
Fig 9.
P
ackage outline SO
T108-1 (SO14)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT108-1
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
7
8
1
14
y
076E06
MS-012
pin 1 index
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.35
0.34
0.16
0.15
0.05
1.05
0.041
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.25
0.01
0.004
0.039
0.016
99-12-27
03-02-19
0
2.5
5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
CBT3126_4
© NXP B.V
. 2009. All rights reserved.
Product data sheet
Rev
. 04 — 12 October 2009
8 of 13
NXP Semiconductors
CBT3126
Quad FET bus s
witch
Fig 10.
Pac
kage outline SOT337-1 (SSOP14)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.21
0.05
1.80
1.65
0.25
0.38
0.25
0.20
0.09
6.4
6.0
5.4
5.2
0.65
1.25
0.2
7.9
7.6
1.03
0.63
0.9
0.7
1.4
0.9
8
0
o
o
0.13
0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT337-1
99-12-27
03-02-19
(1)
w
M
b
p
D
H
E
E
Z
e
c
v
M
A
X
A
y
1
7
14
8
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
MO-150
pin 1 index
0
2.5
5 mm
scale
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm
SOT337-1
A
max.
2
CBT3126_4
© NXP B.V
. 2009. All rights reserved.
Product data sheet
Rev
. 04 — 12 October 2009
9 of 13
NXP Semiconductors
CBT3126
Quad FET bus s
witch
Fig 11.
Pac
kage outline SOT402-1 (TSSOP14)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.72
0.38
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT402-1
MO-153
99-12-27
03-02-18
w
M
b
p
D
Z
e
0.25
17
14
8
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
A
max.
1.1
pin 1 index
P1-P3
P4-P6
P7-P9
P10-P12
P13-P13
CBT3126DB,112
Mfr. #:
Buy CBT3126DB,112
Manufacturer:
NXP Semiconductors
Description:
IC FET BUS SWITCH QUAD 14SSOP
Lifecycle:
New from this manufacturer.
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