BYV410X-600_1 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 01 — 29 June 2009 4 of 10
NXP Semiconductors
BYV410X-600
Enhanced ultrafast dual rectifier diode
5. Thermal characteristics
6. Isolation characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-h)
thermal resistance from
junction to heatsink
with heatsink compound; per diode;
see Figure 3
--5K/W
with heatsink compound; both diodes
conducting
--3K/W
R
th(j-a)
thermal resistance from
junction to ambient free air
-55-K/W
Fig 3. Transient thermal impedance from junction to heatsink per diode as a function of pulse width
001aaf033
1
10
−1
10
Z
th(j-h)
(K/W)
10
−3
10
−2
t
p
(s)
10
−6
10110
−1
10
−5
10
−3
10
−2
10
−4
t
p
t
p
T
P
t
T
δ =
Table 6. Isolation characteristics
Symbol Parameter Conditions Min Typ Max Unit
V
isol(RMS)
RMS isolation voltage 50 Hz < f < 60 Hz; sinusoidal waveform;
relative humidity < 65 %; clean and dust
free; from all terminals to external heatsink
--2500V
C
isol
isolation capacitance from cathode to external heatsink; f = 1 MHz - 10 - pF