ADG5213BRUZ-RL7 Datasheet ADG5212BRUZ, ADG5213BRUZ, ADG5213BCPZ-RL7 | P7-P9

Data Sheet ADG5212/ADG5213

Rev. A | Page 7 of 20

Parameter 25°C −40°C to +85°C −40°C to +125°C Unit Test Conditions/Comments

−3 dB Bandwidth 410 MHz typ R

L

= 50 Ω, C

L

= 5 pF,

see Figure 28

Insertion Loss −6.8 dB typ R

L

= 50 Ω, C

L

= 5 pF, f = 1 MHz,

see Figure 28

C

S

(Off) 3 pF typ V

S

= 18 V, f = 1 MHz

C

D

(Off) 5 pF typ V

S

= 18 V, f = 1 MHz

C

D

(On), C

S

(On) 8 pF typ V

S

= 18 V, f = 1 MHz

POWER REQUIREMENTS V

DD

= 39.6 V

I

DD

80

µA typ

Digital inputs = 0 V or V

DD

100 130 µA max

V

DD

9/40 V min/V max GND = 0 V, V

SS

= 0 V

1

Guaranteed by design; not subject to production test.

CONTINUOUS CURRENT PER CHANNEL, Sx OR Dx

Table 5.

Parameter 25°C 85°C 125°C Unit

CONTINUOUS CURRENT, Sx or Dx

V

DD

= +15 V, V

SS

= −15 V

TSSOP (θ

JA

= 112.6°C/W) 18 10 5 mA maximum

LFCSP (θ

JA

= 30.4°C/W) 32 15 6 mA maximum

V

DD

= +20 V, V

SS

= −20 V

TSSOP (θ

JA

= 112.6°C/W) 29 16 8 mA maximum

LFCSP (θ

JA

= 30.4°C/W) 50 22 9 mA maximum

V

DD

= 12 V, V

SS

= 0 V

TSSOP (θ

JA

= 112.6°C/W) 18 12 7 mA maximum

LFCSP (θ

JA

= 30.4°C/W) 32 17 8 mA maximum

V

DD

= 36 V, V

SS

= 0 V

TSSOP (θ

JA

= 112.6°C/W) 34 18 8 mA maximum

LFCSP (θ

JA

= 30.4°C/W) 59 24 9 mA maximum

ADG5212/ADG5213 Data Sheet

Rev. A | Page 8 of 20

ABSOLUTE MAXIMUM RATINGS

T

A

= 25°C, unless otherwise noted.

Table 6.

Parameter Rating

V

DD

to V

SS

48 V

V

DD

to GND −0.3 V to +48 V

V

SS

to GND +0.3 V to −48 V

Analog Inputs

1

V

SS

− 0.3 V to V

DD

+ 0.3 V or

30 mA, whichever occurs first

Digital Inputs

1

V

SS

− 0.3 V to V

DD

+ 0.3 V or

30 mA, whichever occurs first

Peak Current, Sx or Dx Pin 60 mA (pulsed at 1 ms, 10%

duty cycle maximum)

Continuous Current, Sx or Dx

2

Data + 15%

Temperature

Operating Range −40°C to +125°C

Storage Range

−65°C to +150°C

Junction 150°C

Thermal Impedance, θ

JA

16-Lead TSSOP (4-Layer Board) 112.6°C/W

16-Lead LFCSP (4-Layer Board) 30.4°C/W

Reflow Soldering Peak

Temperature, Pb Free

260(+0/−5)°C

1

Overvoltages at the INx, Sx, and Dx pins are clamped by internal diodes.

Limit current to the maximum ratings given.

2

See Table 5.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Only one absolute maximum rating can be applied at any

one time.

ESD CAUTION

Data Sheet ADG5212/ADG5213

Rev. A | Page 9 of 20

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

IN1

1

D1

2

S1

3

V

SS

4

IN2

16

D2

15

S2

14

V

DD

13

GND

5

NC

12

S4

6

S3

11

D4

7

D3

10

IN4

8

IN3

9

NC = NO CONNECT

ADG5212/

ADG5213

TOP VIEW

(Not to Scale)

09767-002

Figure 2. TSSOP Pin Configuration

NOTES

1. EXPOSED PAD TIED TO SUBSTRATE, V

SS

.

2. NC = NO CONNECT.

1S1

2

V

SS

3GND

4S4

11

V

DD

12 S2

10 NC

9S3

5

D4

6

IN4

7

IN3

8

D3

15

IN1

16

D1

14

IN2

13

D

2

TOP VIEW

(Not to Scale)

ADG5212/

ADG5213

09767-003

Figure 3. LFCSP Pin Configuration

Table 7. Pin Function Descriptions

Pin No.

TSSOP LFCSP Mnemonic Description

1 15 IN1 Logic Control Input.

2 16 D1 Drain Terminal. This pin can be an input or an output.

3 1 S1 Source Terminal. This pin can be an input or an output.

4 2 V

SS

Most Negative Power Supply Potential.

5 3 GND Ground (0 V) Reference.

6 4 S4 Source Terminal. This pin can be an input or an output.

7 5 D4 Drain Terminal. This pin can be an input or an output.

8 6 IN4 Logic Control Input.

9 7 IN3 Logic Control Input.

10 8 D3 Drain Terminal. This pin can be an input or an output.

11 9 S3 Source Terminal. This pin can be an input or an output.

12 10 NC No Connect. These pins are open.

13 11 V

DD

Most Positive Power Supply Potential.

14 12 S2 Source Terminal. This pin can be an input or an output.

15 13 D2 Drain Terminal. This pin can be an input or an output.

16 14 IN2 Logic Control Input.

N/A

1

EP Exposed pad

Exposed Pad. The exposed pad is connected internally. For increased reliability of the

solder joints and maximum thermal capability, it is recommended that the pad be

soldered to the substrate, V

SS

.

1

N/A means not applicable.

Table 8. ADG5212 Truth Table

ADG5212 INx Switch Condition

1 On

0 Off

Table 9. ADG5213 Truth Table

ADG5213 INx S1, S4 S2, S3

0 Off On

1 On Off

ADG5213BRUZ-RL7

ADG5213BRUZ-RL7

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