IRL3803VPBF

IRL3803VPbF
HEXFET
®
Power MOSFET
12/21/04
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 0.74
R
θCS
Case-to-Sink, Flat, Greased Surface 0.50 ––– °C/W
R
θJA
Junction-to-Ambient ––– 62
Thermal Resistance
www.irf.com 1
V
DSS
= 30V
R
DS(on)
= 5.5m
I
D
= 140A
S
D
G
TO-220AB
Advanced HEXFET
®
Power MOSFETs from International
Rectifier utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation
levels to approximately 50 watts. The low thermal
resistance and low package cost of the TO-220 contribute
to its wide acceptance throughout the industry.
Description
Absolute Maximum Ratings
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 140
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 110 A
I
DM
Pulsed Drain Current 470
P
D
@T
C
= 25°C Power Dissipation 200 W
Linear Derating Factor 1.4 W/°C
V
GS
Gate-to-Source Voltage ± 16 V
I
AR
Avalanche Current 71 A
E
AR
Repetitive Avalanche Energy 20 mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Mounting torque, 6-32 or M3 srew 10 lbf•in (1.1N•m)
l Advanced Process Technology
l Ultra Low On-Resistance
l Dynamic dv/dt Rating
l 175°C Operating Temperature
l Fast Switching
l Fully Avalanche Rated
l Lead-Free
PD - 95955
IRL3803VPbF
2 www.irf.com
S
D
G
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.2 V T
J
= 25°C, I
S
= 71A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 52 78 ns T
J
= 25°C, I
F
= 71A
Q
rr
Reverse Recovery Charge ––– 91 140 nC di/dt = 100A/µs
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
Source-Drain Ratings and Characteristics
140
470
A
Starting T
J
= 25°C, L = 160µH
R
G
= 25, I
AS
= 71A, V
GS
=10V (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. (See fig. 11)
Notes:
I
SD
71A, di/dt 110A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
Pulse width 400µs; duty cycle 2%.
This is a typical value at device destruction and represents
operation outside rated limits.
This is a calculated value limited to T
J
= 175°C .
Calculated continuous current based on maximum allowable
junction temperature. Package limitation current is 75A.
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 30 ––– ––– V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.028 V/°C Reference to 25°C, I
D
= 1mA
––– ––– 5.5 V
GS
= 10V, I
D
= 71A
––– ––– 7.5 V
GS
= 4.5V, I
D
= 59A
V
GS(th)
Gate Threshold Voltage 1.0 ––– ––– V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 82 ––– ––– S V
DS
= 25V, I
D
= 71A
––– ––– 25
µA
V
DS
= 30V, V
GS
= 0V
––– ––– 250 V
DS
= 24V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– –– 100 V
GS
= 16V
Gate-to-Source Reverse Leakage ––– ––– -100
nA
V
GS
= -16V
Q
g
Total Gate Charge –– –– 76 I
D
= 71A
Q
gs
Gate-to-Source Charge ––– –– 19 nC V
DS
= 24V
Q
gd
Gate-to-Drain ("Miller") Charge ––– ––– 35 V
GS
= 4.5V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time ––– 16 –– V
DD
= 15V
t
r
Rise Time ––– 180 ––– I
D
= 71A
t
d(off)
Turn-Off Delay Time –– 29 ––– R
G
= 1.3
t
f
Fall Time ––– 37 ––– V
GS
= 4.5V, See Fig. 10
Between lead,
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance ––– 3720 ––– V
GS
= 0V
C
oss
Output Capacitance –– 1480 ––– V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 270 –– pF ƒ = 1.0MHz, See Fig. 5
E
AS
Single Pulse Avalanche Energy ––– 1560400 mJ I
AS
= 71A, L = 0.16mH
S
D
G
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
R
DS(on)
Static Drain-to-Source On-Resistance
I
GSS
nH
L
S
Internal Source Inductance ––– 7.5 –––
L
D
Internal Drain Inductance ––– 4.5 –––
I
DSS
Drain-to-Source Leakage Current
m
IRL3803VPbF
www.irf.com 3
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
10
100
1000
0.1 1 10 100
20µs PULSE WIDTH
T = 25 C
J
°
TOP
BOTTOM
VGS
15V
10V
4.5V
3.7V
3.5V
3.3V
3.0V
2.7V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
2.7V
10
100
1000
0.1 1 10 100
20µs PULSE WIDTH
T = 175 C
J
°
TOP
BOTTOM
VGS
15V
10V
4.5V
3.7V
3.5V
3.3V
3.0V
2.7V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
2.7V
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
0.0
0.5
1.0
1.5
2.0
2.5
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
120A
10
100
1000
2.5 3.5 4.5 5.5 6.5
V = 15V
20µs PULSE WIDTH
DS
V , Gate-to-Source Voltage (V)
I , Drain-to-Source Current (A)
GS
D
T = 25 C
J
°
T = 175 C
J
°

IRL3803VPBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET MOSFT 140A 50.7nC 5.5mOhm LogLvAB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet