LTC3858-2
28
38582f
APPLICATIONS INFORMATION
Design Example
As a design example for one channel, assume V
IN
=
12V(nominal), V
IN
= 22V (max), V
OUT
= 3.3V, I
MAX
= 5A,
V
SENSE(MAX)
= 75mV and f = 350kHz.
The inductance value is chosen first based on a 30% ripple
current assumption. The highest value of ripple current
occurs at the maximum input voltage. Tie the FREQ pin
to GND, generating 350kHz operation. The minimum
inductance for 30% ripple current is:
ΔI
L
=
V
OUT
f
()
L
()
1–
V
OUT
V
IN
A 4.7µH inductor will produce 29% ripple current. The
peak inductor current will be the maximum DC value plus
one half the ripple current, or 5.73A. Increasing the ripple
current will also help ensure that the minimum on-time
of 95ns is not violated. The minimum on-time occurs at
maximum V
IN
:
t
ON(MIN)
=
V
OUT
V
IN
f
()
=
3.3V
22V 350kHz
()
= 429ns
The equivalent R
SENSE
resistor value can be calculated by
using the minimum value for the maximum current sense
threshold (64mV):
R
SENSE
64mV
5.73A
= 0.011Ω
Choosing 0.5% resistors: R
A
= 24.9k and R
B
= 77.7k yields
an output voltage of 3.296V.
The power dissipation on the topside MOSFET can be easily
estimated. Choosing a Fairchild FDS6982S dual MOSFET
results in: R
DS(ON)
= 0.035/0.022, C
MILLER
= 215pF. At
maximum input voltage with T(estimated) = 50°C:
P
MAIN
=
3.3V
22V
5A
()
2
1+ 0.005
()
50°C–25°C
()
0.035Ω
()
+ 22V
()
2
5A
2
2.5Ω
()
215pF
()
1
5V – 2.3V
+
1
2.3V
350kHz
()
= 331mW
A short-circuit to ground will result in a folded back cur-
rent of:
I
SC
=
32mV
0.015Ω
1
2
95ns 22V
()
4.7µH
= 2.98A
with a typical value of R
DS(ON)
and δ = (0.005/°C)(25°C)
= 0.125. The resulting power dissipated in the bottom
MOSFET is:
P
SYNC
= 2.98A
()
2
1.125
()
0.022Ω
()
= 220mW
which is less than full-load conditions.
C
IN
is chosen for an RMS current rating of at least 3A at
temperature assuming only this channel is on. C
OUT
is
chosen with an ESR of 0.02 for low output ripple volt-
age. The output ripple in continuous mode will be highest
at the maximum input voltage. The output voltage ripple
due to ESR is approximately:
V
ORIPPLE
= R
ESR
(ΔI
L
) = 0.02(1.45A) = 29mV
P-P
LTC3858-2
29
38582f
APPLICATIONS INFORMATION
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the IC. These items are also illustrated graphically in the
layout diagram of Figure 11. Figure 12 illustrates the current
waveforms present in the various branches of the 2-phase
synchronous regulators operating in the continuous mode.
Check the following in your layout:
1. Are the top N-channel MOSFETs MTOP1 and MTOP2
located within 1cm of each other with a common drain
connection at C
IN
? Do not attempt to split the input
decoupling for the two channels as it can cause a large
resonant loop.
2. Are the signal and power grounds kept separate? The
combined IC signal ground pin and the ground return
of C
INTVCC
must return to the combined C
OUT
(–) ter-
minals. The path formed by the top N-channel MOSFET,
Schottky diode and the C
IN
capacitor should have short
leads and PC trace lengths. The output capacitor (–)
terminals should be connected as close as possible
to the (–) terminals of the input capacitor by placing
the capacitors next to each other and away from the
Schottky loop described above.
3. Do the LTC3858-2 V
FB
pins’ resistive dividers connect to
the (+) terminals of C
OUT
? The resistive divider must be
connected between the (+) terminal of C
OUT
and signal
ground. The feedback resistor connections should not
be along the high current input feeds from the input
capacitor(s).
4. Are the SENSE
and SENSE
+
leads routed together with
minimum PC trace spacing? The filter capacitor between
SENSE
+
and SENSE
should be as close as possible
to the IC. Ensure accurate current sensing with Kelvin
connections at the SENSE resistor.
5. Is the INTV
CC
decoupling capacitor connected close
to the IC, between the INTV
CC
and the power ground
pins? This capacitor carries the MOSFET drivers’ cur-
rent peaks. An additional 1µF ceramic capacitor placed
immediately next to the INTV
CC
and PGND pins can help
improve noise performance substantially.
6. Keep the switching nodes (SW1, SW2), top gate nodes
(TG1, TG2), and boost nodes (BOOST1, BOOST2) away
from sensitive small-signal nodes, especially from the
opposites channel’s voltage and current sensing feed-
back pins. All of these nodes have very large and fast
moving signals and therefore should be kept on the
“output side” of the LTC3858-2 and occupy minimum
PC trace area.
7. Use a modified “star ground” technique: a low imped-
ance, large copper area central grounding point on
the same side of the PC board as the input and output
capacitors with tie-ins for the bottom of the INTV
CC
decoupling capacitor, the bottom of the voltage feedback
resistive divider and the SGND pin of the IC.
LTC3858-2
30
38582f
APPLICATIONS INFORMATION
PC Board Layout Debugging
Start with one controller on at a time. It is helpful to use
a DC-50MHz current probe to monitor the current in the
inductor while testing the circuit. Monitor the output
switching node (SW pin) to synchronize the oscilloscope
to the internal oscillator and probe the actual output
voltage as well. Check for proper performance over the
operating voltage and current range expected in the ap-
plication. The frequency of operation should be maintained
over the input voltage range down to dropout and until
the output load drops below the low current operation
threshold—typically 10% of the maximum designed
current level in Burst Mode operation.
The duty cycle percentage should be maintained from cycle
to cycle in a well-designed, low noise PCB implementation.
Variation in the duty cycle at a subharmonic rate can sug-
gest noise pickup at the current or voltage sensing inputs
or inadequate loop compensation. Overcompensation of
the loop can be used to tame a poor PC layout if regulator
bandwidth optimization is not required. Only after each
controller is checked for its individual performance should
both controllers be turned on at the same time. A particularly
difficult region of operation is when one controller channel
is nearing its current comparator trip point when the other
channel is turning on its top MOSFET. This occurs around
50% duty cycle on either channel due to the phasing of
the internal clocks and may cause minor duty cycle jitter.
Reduce V
IN
from its nominal level to verify operation of
the regulator in dropout. Check the operation of the un-
dervoltage lockout circuit by further lowering V
IN
while
monitoring the outputs to verify operation.
Investigate whether any problems exist only at higher out-
put currents or only at higher input voltages. If problems
coincide with high input voltages and low output currents,
look for capacitive coupling between the BOOST, SW, TG,
and possibly BG connections and the sensitive voltage
and current pins. The capacitor placed across the current
sensing pins needs to be placed immediately adjacent to
the pins of the IC. This capacitor helps to minimize the
effects of differential noise injection due to high frequency
capacitive coupling. If problems are encountered with
high current output loading at lower input voltages, look
for inductive coupling between C
IN
, Schottky and the top
MOSFET components to the sensitive current and voltage
sensing traces. In addition, investigate common ground
path voltage pickup between these components and the
SGND pin of the IC.
An embarrassing problem, which can be missed in an
otherwise properly working switching regulator, results
when the current sensing leads are hooked up backwards.
The output voltage under this improper hookup will still
be maintained but the advantages of current mode control
will not be realized. Compensation of the voltage loop will
be much more sensitive to component selection. This
behavior can be investigated by temporarily shorting out
the current sensing resistor—don’t worry, the regulator
will still maintain control of the output voltage.

LTC3858IUH-2#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Low IQ, Dual, 2-Phase Synchronous Step-Down Controller without OVP
Lifecycle:
New from this manufacturer.
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