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MC74LVX50DR2
P1-P3
P4-P6
P7-P9
MC74L
VX50
http://onsemi.com
4
Figure 3. Switching W
aveforms
V
CC
GND
50%
50% V
CC
A
Y
t
PHL
t
PLH
*Includes all probe and jig capacitance
Figure 4. T
est Circuit
C
L
*
TEST
POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 5. Input Equivalent Circuit
INPUT
EMBOSSED CARRIER DIMENSIONS
(See Notes 9 and 10)
T
ape
Size
B
1
Max
D
D
1
E
F
K
P
P
0
P
2
R
T
W
8 m
m
4.35
mm
(0.179”)
1.5
mm
+ 0
.
1
−0.
0
(0.059”
+0.004
−0.
0
)
1.0
mm
Min
(0.179”)
1.75
mm
±
0.1
(0.069
±
0.004”)
3.5
mm
±
0.5
(1.38
±
0.002”)
2.4
mm
Max
(0.094”)
4.0
mm
±
0.10
(0.157
±
0.004”)
4.0
mm
±
0.1
(0.157
±
0.004”)
2.0
mm
±
0.1
(0.079
±
0.004”)
25
mm
(0.98”)
0.6
mm
(0.024)
8.3
mm
(0.327)
12
mm
8.2
mm
(0.323”)
1.5
mm
Min
(0.060)
5.5
mm
±
0.5
(0.217
±
0.002”)
6.4
mm
Max
(0.252”)
4.0
mm
±
0.10
(0.157
±
0.004”)
8.0
mm
±
0.10
(0.315
±
0.004”)
30
mm
(1.18”)
12.0
mm
±
0.3
(0.470
±
0.012”)
16
mm
12.1
mm
(0.476”)
7.5
mm
±
0.10
(0.295
±
0.004”)
7.9
mm
Max
(0.31
1”)
4.0
mm
±
0.10
(0.157
±
0.004”)
8.0
mm
±
0.10
(0.315
±
0.004”)
12.0
mm
±
0.10
(0.472
±
0.004”)
16.3
mm
(0.642)
24
mm
20.1
mm
(0.791”)
11
.
5
m
m
±
0.10
(0.453
±
0.004”)
11
.
9
m
m
Max
(0.468”)
16.0
mm
±
0.10
(0.63
±
0.004”)
24.3
mm
(0.957)
9.
Metric Dimensions Govern−English are in parentheses for reference only
.
10.
A
0
, B
0
, and K
0
are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0.50 mm max. The component cannot rotate more than 10
°
within the determined cavity
MC74L
VX50
http://onsemi.com
5
D
1
FOR COMPONENTS
10 PITCHES
CUMULA
TIVE
TOLERANCE ON
T
APE
±
0.2 mm
(
±
0.008”)
2.0 mm
×
1.2 mm
AND LARGER
CENTER
LINES
OF CA
VITY
EMBOSSMENT
USER DIRECTION OF FEED
K
0
SEE
NOTE
11
P
0
P
2
D
E
F
W
B
0
+
+
+
K
t
B
1
TOP
COVER
T
APE
P
SEE
NOTE
1
1
A
0
FOR MACHINE REFERENCE
ONL
Y
INCLUDING DRAFT AND RADII
CONCENTRIC AROUND B
0
R MIN.
T
APE AND COMPONENTS
SHALL P
ASS AROUND RADIUS “R”
WITHOUT DAMAGE
BENDING RADIUS
*TOP COVER
T
APE THICKNESS (t
1
)
0.10 mm
(0.004”) MAX.
EMBOSSED
CARRIER
EMBOSSMENT
TYPICAL
COMPONENT CA
VITY
CENTER LINE
TYPICAL
COMPONENT
CENTER LINE
MAXIMUM COMPONENT ROT
A
TION
10
°
CAMBER (TOP
VIEW)
ALLOW
ABLE CAMBER
TO BE
1
mm/100
mm NONACCUMULA
TIVE
OVER
250
mm
100 mm
(3.937”)
1 mm
(0.039”) MAX
250 mm
(9.843”)
1 mm MAX
T
APE
11
.
A
0
, B
0
, and K
0
are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0.50 mm max. The component cannot rotate more than 10
°
within the determined cavity
Figure 6. Carrier T
ape Specifications
MC74L
VX50
http://onsemi.com
6
13.0 mm
±
0.2 mm
(0.512”
±
0.008”)
1.5 mm
MIN
(0.06”)
50 mm MIN
(1.969”)
20.2
mm
MIN
(0.795”)
FULL RADIUS
t MAX
G
A
Figure 7. Reel Dimensions
REEL DIMENSIONS
T
ape Size
T&R Suffix
A Max
G
t Max
8 mm
T1, T2
178 mm
(7”)
8.4 mm, +1.5 mm, −0.0
(0.33” + 0.059”, −0.00)
14.4 mm
(0.56”)
8 mm
T3, T4
330 mm
(13”)
8.4 mm, +1.5 mm, −0.0
(0.33” + 0.059”, −0.00)
14.4 mm
(0.56”)
12 mm
R2
330 mm
(13”)
12.4 mm, +2.0 mm, −0.0
(0.49” + 0.079”, −0.00)
18.4 mm
(0.72”)
16 mm
R2
360 mm
(14.173”)
16.4 mm, +2.0 mm, −0.0
(0.646” + 0.078”, −0.00)
22.4 mm
(0.882”)
24 mm
R2
360 mm
(14.173”)
24.4 mm, +2.0 mm, −0.0
(0.961” + 0.078”, −0.00)
30.4 mm
(1.197”)
DIRECTION OF FEED
BARCODE LABEL
HOLE
POCKET
Figure 8. Reel Winding Direction
P1-P3
P4-P6
P7-P9
MC74LVX50DR2
Mfr. #:
Buy MC74LVX50DR2
Manufacturer:
ON Semiconductor
Description:
IC BUF NON-INVERT 3.6V 14SOIC
Lifecycle:
New from this manufacturer.
Delivery:
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EMS
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