MC74LVX50DR2

MC74LVX50
http://onsemi.com
4
Figure 3. Switching Waveforms
V
CC
GND
50%
50% V
CC
A
Y
t
PHL
t
PLH
*Includes all probe and jig capacitance
Figure 4. Test Circuit
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 5. Input Equivalent Circuit
INPUT
EMBOSSED CARRIER DIMENSIONS (See Notes 9 and 10)
Tape
Size
B
1
Max
D D
1
E F K P P
0
P
2
R T W
8 mm 4.35 mm
(0.179”)
1.5 mm
+ 0.1
−0.0
(0.059”
+0.004
−0.0)
1.0 mm
Min
(0.179”)
1.75 mm
±0.1
(0.069
±0.004”)
3.5 mm
±0.5
(1.38
±0.002”)
2.4 mm
Max
(0.094”)
4.0 mm
±0.10
(0.157
±0.004”)
4.0 mm
±0.1
(0.157
±0.004”)
2.0 mm
±0.1
(0.079
±0.004”)
25 mm
(0.98”)
0.6 mm
(0.024)
8.3 mm
(0.327)
12 mm 8.2 mm
(0.323”)
1.5 mm
Min
(0.060)
5.5 mm
±0.5
(0.217
±0.002”)
6.4 mm
Max
(0.252”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
30 mm
(1.18”)
12.0 mm
±0.3
(0.470
±0.012”)
16 mm 12.1 mm
(0.476”)
7.5 mm
±0.10
(0.295
±0.004”)
7.9 mm
Max
(0.311”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
12.0 mm
±0.10
(0.472
±0.004”)
16.3 mm
(0.642)
24 mm 20.1 mm
(0.791”)
11.5 mm
±0.10
(0.453
±0.004”)
11.9 mm
Max
(0.468”)
16.0 mm
±0.10
(0.63
±0.004”)
24.3 mm
(0.957)
9. Metric Dimensions Govern−English are in parentheses for reference only.
10.A
0
, B
0
, and K
0
are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0.50 mm max. The component cannot rotate more than 10° within the determined cavity
MC74LVX50
http://onsemi.com
5
D
1
FOR COMPONENTS
10 PITCHES
CUMULATIVE
TOLERANCE ON
TAPE
±0.2 mm
(±0.008”)
2.0 mm × 1.2 mm
AND LARGER
CENTER
LINES
OF CAVITY
EMBOSSMENT
USER DIRECTION OF FEED
K
0
SEE
NOTE
11
P
0
P
2
D
E
F
W
B
0
++ +
K
t
B
1
TOP
COVER
TAPE
P
SEE NOTE 11
A
0
FOR MACHINE REFERENCE
ONLY
INCLUDING DRAFT AND RADII
CONCENTRIC AROUND B
0
R MIN.
TAPE AND COMPONENTS
SHALL PASS AROUND RADIUS “R”
WITHOUT DAMAGE
BENDING RADIUS
*TOP COVER
TAPE THICKNESS (t
1
)
0.10 mm
(0.004”) MAX.
EMBOSSED
CARRIER
EMBOSSMENT
TYPICAL
COMPONENT CAVITY
CENTER LINE
TYPICAL
COMPONENT
CENTER LINE
MAXIMUM COMPONENT ROTATION
10°
CAMBER (TOP VIEW)
ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250
mm
100 mm
(3.937”)
1 mm
(0.039”) MAX
250 mm
(9.843”)
1 mm MAX
TAPE
11. A
0
, B
0
, and K
0
are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0.50 mm max. The component cannot rotate more than 10° within the determined cavity
Figure 6. Carrier Tape Specifications
MC74LVX50
http://onsemi.com
6
13.0 mm ±0.2 mm
(0.512” ±0.008”)
1.5 mm MIN
(0.06”)
50 mm MIN
(1.969”)
20.2 mm MIN
(0.795”)
FULL RADIUS
t MAX
G
A
Figure 7. Reel Dimensions
REEL DIMENSIONS
Tape Size T&R Suffix A Max G t Max
8 mm T1, T2 178 mm
(7”)
8.4 mm, +1.5 mm, −0.0
(0.33” + 0.059”, −0.00)
14.4 mm
(0.56”)
8 mm T3, T4 330 mm
(13”)
8.4 mm, +1.5 mm, −0.0
(0.33” + 0.059”, −0.00)
14.4 mm
(0.56”)
12 mm R2 330 mm
(13”)
12.4 mm, +2.0 mm, −0.0
(0.49” + 0.079”, −0.00)
18.4 mm
(0.72”)
16 mm R2 360 mm
(14.173”)
16.4 mm, +2.0 mm, −0.0
(0.646” + 0.078”, −0.00)
22.4 mm
(0.882”)
24 mm R2 360 mm
(14.173”)
24.4 mm, +2.0 mm, −0.0
(0.961” + 0.078”, −0.00)
30.4 mm
(1.197”)
DIRECTION OF FEED
BARCODE LABEL
HOLEPOCKET
Figure 8. Reel Winding Direction

MC74LVX50DR2

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC BUF NON-INVERT 3.6V 14SOIC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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