ATF-551M4
Low Noise Enhancement Mode Pseudomorphic
HEMT in a Miniature Leadless Package
Data Sheet
Description
The Broadcom® ATF-551M4 is a high dynamic range,
super low noise, single supply E-pHEMT GaAs FET
housed in a thin miniature leadless package.
The combination of small device size, super low noise
(under 1 dB Fmin from 2 to 6 GHz), high linearity and
low power makes the ATF-551M4 ideal for LNA or hybrid
module designs in wireless receiver in the 450 MHz to
10 GHz frequency band.
Applications include Cellular/PCS/ WCDMA handsets
and data modem cards,  xed wireless infrastructure
in the 2.4, 3.5 GHz and UNII frequency bands, as well
as 2.4 GHz 802.11b, 5 GHz 802.11a and HIPERLAN/2
Wireless LAN PC-cards.
Note:
1. Broadcoms enhancement mode E-pHEMT devices are the  rst com-
mercially available single-supply GaAs transistors that do not need a
negative gate bias voltage for operation. They can help simplify the
design and reduce the cost of receivers and transmitters in many
applications in the 450 MHz to 10 GHz frequency range.
Features
Very low noise  gure and high linearity
Single Supply Enhancement Mode Technology
[1]
optimized for 3V operation
Excellent uniformity in product speci cations
400 micron gate width
Thin miniature package 1.4 mm x 1.2 mm x 0.7 mm
Tape-and-reel packaging option available
Speci cations
2 GHz; 2.7V, 10 mA (typ.)
24.1 dBm output 3
rd
order intercept
14.6 dBm output power at 1 dB gain compression
0.5 dB noise  gure
17.5 dB associated gain
Applications
Low Noise Ampli er for:
Cellular/PCS/WCDMA handsets and modem cards
2.4 GHz, 3.5 GHz and UNII  xed wireless infrastructure
2.4 GHz 802.11b Wireless LAN
5 GHz 802.11a and HIPERLAN Wireless LAN
General purpose discrete E-pHEMT for other ultra low
noise applications
MiniPak 1.4 mm x 1.2 mm Package
Pin Connections and Package Marking
Note:
Top View. Package marking provides orientation, product identi ca-
tion and date code.
“V = Device Type Code
“x” = Date code character. A di erent character is assigned for each
month and year.
Source
Pin 3
Gate
Pin 2
Source
Pin 1
Drain
Pin 4
Vx
Vx
2
ATF-551M4 Absolute Maximum Ratings
[1]
Symbol Parameter Units Absolute Maximum
V
DS
Drain-Source Voltage
[2]
V5
V
GS
Gate-Source Voltage
[2]
V -5 to +1
V
GD
Gate Drain Voltage
[2]
V -5 to +1
I
DS
Drain Current
[2]
mA 100
I
GS
Gate Current
[5]
mA 1
P
diss
Total Power Dissipation
[3]
mW 270
P
in max.
RF Input Power
(Vd=2.7V, Id=10mA)
(Vd=0V, Id=0mA)
dBm
dBm
10
10
T
CH
Channel Temperature °C 150
T
STG
Storage Temperature °C -65 to 150
θ
jc
Thermal Resistance
[4]
°C/W 240
Notes:
1. Operation of this device above any one of these parameters may
cause permanent damage.
2. Assumes DC quiescent conditions.
3. Source lead temperature is 25°C. Derate 4.2 mW/°C for T
L
> 85°C.
4. Thermal resistance measured using 150°C Liquid Crystal Measure-
ment method.
5. Device can safely handle +10 dBm RF Input Power provided I
GS
is
limited to 1 mA. I
GS
at P
1dB
drive RF level is bias circuit dependent.
See applications section for additional information.
V
DS
(V)
Figure 1. Typical I-V Curves.
(V
GS
= 0.1 V per step)
I
DS
(mA)
0.4V
0.5V
0.6V
0.7V
0.3V
02146537
70
60
50
40
30
20
10
0
Note:
6. Distribution data sample size is 398 samples taken from 4 di erent wafers. Future wafers allocated to this product may have nominal values
anywhere between the upper and lower limits. Measurements made on production test board. This circuit represents a trade-o between
an optimal noise match and a realizeable match based on production test equipment. Circuit losses have been de-embedded from actual
measurements.
GAIN (dB)
Figure 2. Capability Plot for Gain @ 2.7V,
10 mA. LSL = 15.5, Nominal = 17.5,
USL = 18.5
15 1716 18 19
180
150
120
90
60
30
0
Cpk = 1.64
Stdev = 0.19
-3 Std +3 Std
NF (dB)
Figure 4. Capability Plot for NF @ 2.7V,
10 mA. Nominal = 0.5, USL = 0.9
0.29 0.690.49 0.89 1.09
160
120
80
40
0
Cpk = 2.46
Stdev = 0.06
+3 Std
OIP3 (dBm)
Figure 3. Capability Plot for OIP3 @ 2.7V,
10 mA. LSL = 22.0, Nominal = 24.1
22 2423 25 26
150
120
90
60
30
0
Cpk = 2.85
Stdev = 0.25
-3 Std
Product Consistency Distribution Charts
[6]
3
ATF-551M4 Electrical Speci cations
T
A
= 25°C, RF parameters measured in a test circuit for a typical device
Symbol Parameter and Test Condition Units Min. Typ. Max.
Vgs
Operational Gate Voltage Vds = 2.7V, Ids = 10 mA V 0.3 0.47 0.65
Vth
Threshold Voltage Vds = 2.7V, Ids = 2 mA V 0.18 0.37 0.53
Idss
Saturated Drain Current Vds = 2.7V, Vgs = 0V μA 0.1 3
Gm
Transconductance Vds = 2.7V, gm = Idss/Vgs; mmho 110 220 285
Vgs = 0.75 0.7 = 0.05V
Igss Gate Leakage Current Vgd = Vgs = -2.7V μA 95
NF Noise Figure
[1]
f = 2 GHz Vds = 2.7V, Ids = 10 mA dB 0.5 0.9
Vds = 3V, Ids = 20 mA dB 0.5
Gain Gain
[1]
f = 2 GHz Vds = 2.7V, Ids = 10 mA dB 15.5 17.5 18.5
Vds = 3V, Ids = 20 mA dB 18.0
OIP3
Output 3
rd
Order f = 2 GHz Vds = 2.7V, Ids = 10 mA dBm 22 24.1
Intercept Point
[1]
Vds = 3V, Ids = 20 mA dBm 30.0
P1dB
1dB Compressed f = 2 GHz Vds = 2.7V, Ids = 10 mA dBm 14.6
Output Power
[1]
Vds = 3V, Ids = 20 mA dBm 16.0
Notes:
1. Measurements obtained using production test board described in Figure 5. Typical values were determined from a sample size of 398 parts
from 4 wafers.
Figure 5. Block diagram of 2 GHz production test board used for Noise Figure, Gain, P1dB, OIP3, and IIP3 measurements. This circuit represents a trade-
o between an optimal noise match, maximum OIP3 match and associated impedance matching circuit losses. Circuit losses have been de-embedded
from actual measurements.
Symbol Parameter and Test Condition Units Min. Typ. Max.
Fmin Minimum Noise Figure
[2]
f = 900 MHz Vds = 2.7V, Ids = 10 mA dB 0.27
f = 2 GHz Vds = 2.7V, Ids = 10 mA dB 0.41
f = 3.9 GHz Vds = 2.7V, Ids = 10 mA dB 0.61
f = 5.8 GHz Vds = 2.7V, Ids = 10 mA dB 0.88
Ga Associated Gain
[2]
f = 900 MHz Vds = 2.7V, Ids = 10 mA dB 21.8
f = 2 GHz Vds = 2.7V, Ids = 10 mA dB 17.9
f = 3.9 GHz Vds = 2.7V, Ids = 10 mA dB 14.2
f = 5.8 GHz Vds = 2.7V, Ids = 10 mA dB 12.0
OIP3
Output 3
rd
Order f = 900 MHz Vds = 2.7V, Ids = 10 mA dBm 22.1
Intercept Point
[3]
f = 3.9 GHz Vds = 2.7V, Ids = 10 mA dBm 24.3
f = 5.8 GHz Vds = 2.7V, Ids = 10 mA dBm 24.5
P1dB
1dB Compressed f = 900 MHz Vds = 2.7V, Ids = 10 mA dBm 14.3
Output Power
[3]
f = 3.9 GHz Vds = 2.7V, Ids = 10 mA dBm 14.5
f = 5.8 GHz Vds = 2.7V, Ids = 10 mA dBm 14.3
Notes:
2. The Fmin values are based on a set of 16 noise  gure measurements made at 16 di erent impedances using an ATN NP5 test system. From
these measurements Fmin is calculated. Refer to the noise parameter measurement section for more information.
3. Measurements taken above and below 2 GHz was made using a double stub tuner at the input tuned for low noise and a double stub tuner at
the output tuned for maximum OIP3. Circuit losses have been de-embedded from actual measurements.
ATF-551M4 Electrical Speci cations (see notes 2 and 3, as indicated)
Input
50 Input
Transmission
Line Including
Gate Bias T
(0.3 dB loss)
Input
Matching Circuit
Γ_mag = 0.3
Γ_ang = 11
(0.3 dB loss)
Output
Matching Circuit
Γ_mag = 0.3
Γ_ang = 9
(0.9 dB loss)
DUT
50 Output
Transmission
Line Including
Gate Bias T
(0.3 dB loss)
Output

ATF-551M4-TR1

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
RF JFET Transistors Transistor GaAs Single Voltage
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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