CY7C1059DV33-10BAXI

PRELIMINARY
8-Mbit (1M x 8) Static RAM
CY7C1059DV33
Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600
Document #: 001-00061 Rev. *B Revised July 21, 2006
Features
•High speed
—t
AA
= 10 ns
Low active power
—I
CC
= 110 mA
Low CMOS standby power
—I
SB2
= 20 mA
2.0V data retention
Automatic power-down when deselected
TTL-compatible inputs and outputs
Easy memory expansion with CE
and OE features
Available in lead-free 36-ball FBGA and 44-pin TSOP II
ZS44 packages
Functional Description
[1]
The CY7C1059DV33 is a high-performance CMOS Static
RAM organized as 1M words by 8 bits. Easy memory
expansion is provided by an active LOW Chip Enable (CE), an
active LOW Output Enable (OE
), and tri-state drivers. Writing
to the device is accomplished by taking Chip Enable (CE
) and
Write Enable (WE
) inputs LOW. Data on the eight I/O pins (I/O
0
through I/O
7
) is then written into the location specified on the
address pins (A
0
through A
19
).
Reading from the device is accomplished by taking Chip
Enable (CE
) and Output Enable (OE) LOW while forcing Write
Enable (WE
) HIGH. Under these conditions, the contents of
the memory location specified by the address pins will appear
on the I/O pins.
The eight input/output pins (I/O
0
through I/O
7
) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), or during a Write
operation (CE
LOW, and WE LOW).
The CY7C1059DV33 is available in 36-ball FBGA and 44-pin
TSOP II package with center power and ground (revolutionary)
pinout.
Note:
1. For guidelines on SRAM system design, please refer to the ‘System Design Guidelines’ Cypress application note, available on the internet at www.cypress.com.
14
15
Logic Block Diagram
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
COLUMN
DECODER
ROW DECODER
SENSE AMPS
INPUT BUFFER
POWER
DOWN
WE
OE
I/O
0
I/O
1
I/O
2
I/O
3
1M x 8
ARRAY
I/O
7
I/O
6
I/O
5
I/O
4
A
0
A
11
A
13
A
12
A
CE
A
A
16
A
17
A
9
A
18
A
10
A
19
PRELIMINARY
CY7C1059DV33
Document #: 001-00061 Rev. *B Page 2 of 9
Pin Configuration
A
15
V
CC
A
13
A
12
A
5
NC
WE
A
7
I/O
4
I/O
5
A
4
I/O
6
I/O
7
V
SS
A
11
A
10
A
1
V
SS
I/O
0
A
2
A
8
A
6
A
3
A
0
V
CC
I/O
1
I/O
2
I/O
3
A
17
A
18
A
16
CE
OE
A
9
A
14
3
2
6
5
4
1
D
E
B
A
C
F
G
H
36-ball FBGA
A
19
A
6
1
2
3
4
5
6
7
8
9
10
11
14
31
32
36
35
34
33
37
40
39
38
Top View
TSOP II
12
13
41
44
43
42
16
15
29
30
V
CC
A
7
A
8
A
9
NC
NC
NC
NC
A
18
V
SS
NC
A
15
A
0
I/O
0
A
4
CE
A
17
A
12
A
1
18
17
20
19
I/O
1
27
28
25
26
22
21
23
24
NC
V
SS
WE
I/O
2
I/O
3
A
5
NC
A
16
V
CC
OE
I/O
7
I/O
6
I/O
5
I/O
4
A
14
A
13
A
11
A
10
A
19
NC
NC
A
2
A
3
(Top View)
Selection Guide
–10 Unit
Maximum Access Time 10 ns
Maximum Operating Current 110 mA
Maximum CMOS Standby Current 20 mA
PRELIMINARY
CY7C1059DV33
Document #: 001-00061 Rev. *B Page 3 of 9
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature .................................–65°C to +150°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage on V
CC
to Relative GND
[2]
.... –0.5V to +4.6V
DC Voltage Applied to Outputs
in High-Z State
[2]
....................................–0.3V to V
CC
+ 0.3V
DC Input Voltage
[2]
................................ –0.3V to V
CC
+ 0.3V
Current into Outputs (LOW).........................................20 mA
Static Discharge Voltage............................................>2001V
(per MIL-STD-883, Method 3015)
Latch-up Current......................................................>200 mA
Operating Range
Range Ambient Temperature V
CC
Industrial –40°C to +85°C3.3V ± 0.3V
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions
–10
UnitMin. Max.
V
OH
Output HIGH Voltage V
CC
= Min., I
OH
= –4.0 mA 2.4 V
V
OL
Output LOW Voltage V
CC
= Min., I
OL
= 8.0 mA 0.4 V
V
IH
Input HIGH Voltage 2.0 V
CC
+ 0.3 V
V
IL
Input LOW Voltage
[2]
–0.3 0.8 V
I
IX
Input Leakage Current GND < V
I
< V
CC
–1 +1 µA
I
OZ
Output Leakage Current GND < V
OUT
< V
CC
, Output Disabled –1 +1 µA
I
CC
V
CC
Operating
Supply Current
V
CC
= Max., f = f
MAX
= 1/t
RC
100 MHz 110 mA
83 MHz 100
66 MHz 90
40 MHz 80
I
SB1
Automatic CE Power-down
Current —TTL Inputs
Max. V
CC
, CE > V
IH
V
IN
> V
IH
or V
IN
< V
IL
, f = f
MAX
40 mA
I
SB2
Automatic CE Power-down
Current —CMOS Inputs
Max. V
CC
, CE > V
CC
– 0.3V,
V
IN
> V
CC
– 0.3V, or V
IN
< 0.3V, f = 0
20 mA
Capacitance
[3]
Parameter Description Test Conditions Max. Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz,
V
CC
= 3.3V
16 pF
C
OUT
I/O Capacitance 16 pF
Thermal Resistance
[3]
Parameter Description Test Conditions FBGA TSOP II Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
four-layer printed circuit board
TBD TBD °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
TBD TBD °C/W
Notes:
2. V
IL
(min.) = –2.0V and V
IH
(max.) = V
CC
+ 2V for pulse durations of less than 20 ns.
3. Tested initially and after any design or process changes that may affect these parameters.

CY7C1059DV33-10BAXI

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
IC SRAM 8M PARALLEL 36FBGA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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