DS171 (v1.0) March 14, 2017 www.xilinx.com
Product Specification 1
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General Description
The Xilinx Automotive (XA) Spartan®-7 family of FPGAs, using the high-K metal gate (HKMG) process, provides the best combination of
high performance and low power to service a wide variety of automotive applications. XA Spartan-7 FPGAs use the same 28HPL process
as the established 7 series families and benefit from many of the same underlying architectural elements. The result is a family of compact,
cost-optimized FPGAs that provide high logic and I/O performance with strictly controlled power consumption that are able to fit into
aggressively small form factor packaging—all at a low cost.
The six-member family delivers expanded densities ranging from 6,000 to 102,400 logic cells and faster, more comprehensive
connectivity. The XA Spartan-7 family offers a new, more efficient, dual-register 6-input look-up table (LUT) logic and a rich selection of
built-in system-level blocks. These include 36Kb (2 x 18Kb) block RAMs with built-in FIFO logic for on-chip data buffering, DSP slices with
25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering,
enhanced mixed-mode clock management blocks, SelectIO™ technology with support of DDR3 interfacing up to 800Mb/s, advanced
system-level power management modes, auto-detect configuration options, and enhanced IP security with AES and Device DNA
protection. These features provide a low-cost programmable alternative to custom ASIC products with unprecedented ease of use.
XA Spartan-7 FPGAs offer the best solution for flexible and scalable high-volume logic designs, high-bandwidth parallel DSP processing
designs, and cost-sensitive applications where multiple interfacing standards are required.
Summary of XA Spartan-7 FPGA Features
• Automotive Temperatures:
• I-Grade: T
j
= –40°C to +100°C
• Q-Grade: T
j
= –40°C to +125°C
• Automotive Standards:
• Xilinx is ISO-TS16949 compliant
• AEC-Q100 qualification
• Production Part Approval Process (PPAP) documentation
• Beyond AEC-Q100 qualification is available upon request
• Designed for low cost
• Multiple efficient integrated blocks
• Optimized selection of I/O standards
• High-volume plastic wire-bonded packages
• Low static and dynamic power
• 28 nm process optimized for cost and low power
• High-performance SelectIO technology with support for DDR3
• Up to 1250 Mb/s data transfer rate per differential I/O
• Selectable output drive, up to 24mA per pin
• 3.3V to 1.2V I/O standards and protocols
• Low-cost HSTL and SSTL memory interfaces
• Adjustable I/O slew rates to improve signal integrity
• Efficient DSP slices
• High-performance arithmetic and signal processing
• Fast 25 x 18 multiplier and 48-bit accumulator
• Pipelining and cascading capability
• Pre-adder to assist filter applications
• Integrated Memory Controller blocks
• DDR, DDR2, DDR3, and LPDDR support
• Data rates up to 800Mb/s
• Multi-port bus structure with independent FIFO to reduce
design timing issues
• Abundant logic resources with increased logic capacity
• Optional shift register or distributed RAM support
• Efficient 6-input LUTs improve performance and minimize
power
• LUT with dual flip-flops for pipeline centric applications
• Block RAM with a wide range of granularity
• Fast block RAM with byte write enable
• 36Kb blocks that can be optionally programmed as two
independent 18Kb block RAMs
• Clock Management Tile (CMT) for enhanced performance
• Low noise, flexible clocking
• Digital Clock Managers (DCMs) eliminate clock skew and
duty cycle distortion
• Phase-Locked Loops (PLLs) for low-jitter clocking
• Frequency synthesis with simultaneous multiplication,
division, and phase shifting
• 32 low-skew global clock networks
• Simplified configuration supports low-cost standards:
• 2-pin auto-detect configuration
• Broad third-party SPI (up to x4) flash support
• Multi-boot support for remote upgrade with multiple
bitstreams, using watchdog protection
• Enhanced security for design protection.
• Unique Device DNA identifier for design authentication
• Wide variety of configuration options, including support for
commodity memories, 256-bit AES encryption with HMAC/SHA-
256 authentication, and built-in SEU detection and correction
• Industry-leading IP and reference designs
• Strong automotive-specific third-party ecosystem with IP,
development boards, and design services
XA Spartan-7 Automotive FPGA
Data Sheet: Overview
DS171 (v1.0) March 14, 2017 Product Specification