Data Sheet: Overview
DS171 (v1.0) March 14, 2017 www.xilinx.com
Product Specification 5
Digital Signal Processing — DSP Slice
Some highlights of the DSP functionality include:
• 25 × 18 twos complement multiplier/accumulator high-resolution (48 bit) signal processor
• Power saving pre-adder to optimize symmetrical filter applications
• Advanced features: optional pipelining, optional ALU, and dedicated buses for cascading
DSP applications use many binary multipliers and accumulators, best implemented in dedicated DSP slices. All 7 series
FPGAs have many dedicated, full custom, low-power DSP slices, combining high speed with small size while retaining
system design flexibility.
Each DSP slice fundamentally consists of a dedicated 25 × 18 bit two's complement multiplier and a 48-bit accumulator,
both capable of operating up to 550MHz. The multiplier can be dynamically bypassed, and two 48-bit inputs can feed a
single-instruction-multiple-data (SIMD) arithmetic unit (dual 24-bit add/subtract/accumulate or quad 12-bit
add/subtract/accumulate), or a logic unit that can generate any one of ten different logic functions of the two operands.
The DSP includes an additional pre-adder, typically used in symmetrical filters. This pre-adder improves performance in
densely packed designs and reduces the DSP slice count by up to 50%. The DSP also includes a 48-bit-wide Pattern
Detector that can be used for convergent or symmetric rounding. The pattern detector is also capable of implementing
96-bit-wide logic functions when used in conjunction with the logic unit.
The DSP slice provides extensive pipelining and extension capabilities that enhance the speed and efficiency of many
applications beyond digital signal processing, such as wide dynamic bus shifters, memory address generators, wide bus
multiplexers, and memory-mapped I/O register files. The accumulator can also be used as a synchronous up/down counter.
Input/Output
Some highlights of the input/output functionality include:
• High-performance SelectIO technology with support for 800Mb/s DDR3
• Digitally Controlled Impedance that can be 3-stated for lowest power, high-speed I/O operation
The number of I/O pins varies depending on device and package size. Each I/O is configurable and can comply with a large
number of I/O standards. With the exception of the supply pins and a few dedicated configuration pins, all other package pins
have the same I/O capabilities, constrained only by certain banking rules. The I/O in XA Spartan-7 FPGAs are classed as
high range (HR). HR I/Os offer a wide range of voltage support, from 1.2V to 3.3V.
HR I/O pins in XA Spartan-7 FPGAs are organized in banks, with 50 pins per bank. Each bank has one common V
CCO
output supply, which also powers certain input buffers. Some single-ended input buffers require an internally generated or an
externally applied reference voltage (V
REF
). There are two V
REF
pins per bank (except configuration bank 0). A single bank
can have only one V
REF
voltage value.
XA Spartan-7 FPGAs use small form factor wire-bond packages for lowest cost.
I/O Electrical Characteristics
Single-ended outputs use a conventional CMOS push/pull output structure driving High towards V
CCO
or Low towards
ground, and can be put into a high-Z state. The system designer can specify the slew rate and the output strength. The input
is always active but is usually ignored while the output is active. Each pin can optionally have a weak pull-up or a weak pull-
down resistor.
Most signal pin pairs can be configured as differential input pairs or output pairs. Differential input pin pairs can optionally be
terminated with a 100Ω internal resistor. All XA Spartan-7 devices support differential standards beyond LVDS: RSDS,
BLVDS, differential SSTL, and differential HSTL.
Each of the I/Os supports memory I/O standards, such as single-ended and differential HSTL as well as single-ended SSTL
and differential SSTL. The SSTL I/O standard can support data rates of up to 800Mb/s for DDR3 interfacing applications.