4
FN9076.6
December 3, 2015
Typical Application - 4 Channel Converter Using a HIP6303 and HIP6602B Gate Driver
MAIN
CONTROL
HIP6303
FB
+5V
COMP
PWM1
PWM2
ISEN2
PWM3
PWM4
ISEN4
VSEN
FS/DIS
ISEN1
ISEN3
GND
BOOT2
UGATE2
PHASE2
LGATE2
BOOT1
UGATE1
PHASE1
LGATE1
PWM1
PVCC
+5V/12V
VCC
DUAL
DRIVER
HIP6602B
BOOT4
UGATE4
LGATE4
BOOT3
UGATE3
PHASE3
LGATE3
PWM3
PVCC
VCC
DUAL
DRIVER
HIP6602B
V
CC
+V
CORE
PWM2
PWM4
EN
VID
PGOOD
+12V
+12V
+12V
+12V
+12V
+5V/12V
+12V
PGNDGND
PGNDGND
PHASE4
HIP6602B
5
FN9076.6
December 3, 2015
Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15V
Supply Voltage (PVCC) . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.3V
BOOT Voltage (V
BOOT
- V
PHASE
) . . . . . . . . . . . . . . . . . . . . . . .15V
Input Voltage (V
PWM
) . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 7V
UGATE. . . . . . . V
PHASE
- 5V(<400ns pulse width) to V
BOOT
+ 0.3V
V
PHASE
-0.3V(>400ns pulse width) to V
BOOT
+ 0.3V
LGATE . . . . . . . . . GND - 5V(<400ns pulse width) to V
PVCC
+ 0.3V
GND -0.3V(>400ns pulse width) to V
PVCC
+ 0.3V
PHASE. . . . . . . . . . . . . . . . . . GND -5V(<400ns pulse width) to 15V
GND -0.3V(>400ns pulse width) to 15V
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . . . .3kV
Machine Model (Per EIAJ ED-4701 Method C-111). . . . . . . .200V
Operating Conditions
Ambient Temperature Range. . . . . . . . . . . . . . . . . . . . . 0°C to 85°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . . . 125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V 10%
Supply Voltage Range PVCC . . . . . . . . . . . . . . . . . . . . . 5V to 12V
Thermal Information
Thermal Resistance
JA
(°C/W)
JC
(°C/W)
SOIC Package (Note 2) . . . . . . . . . . . . 68 N/A
QFN Package (Note 3). . . . . . . . . . . . . 36 6
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
For Recommended soldering conditions see Tech Brief TB389.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2.
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3.
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features.
JC,
the
“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
Electrical Specifications Recommended Operating Conditions, unless otherwise specified.
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
VCC SUPPLY CURRENT
Bias Supply Current I
VCC
f
PWM
= 500kHz, V
PVCC
= 12V - 3.7 5.0 mA
Power Supply Current I
PVCC
f
PWM
= 500kHz, V
PVCC
= 12V - 2.0 4.0 mA
POWER-ON RESET
VCC Rising Threshold 9.7 9.95 10.4 V
VCC Falling Threshold 7.3 7.6 8.0 V
PWM INPUT
Input Current I
PWM
V
PWM
= 0 or 5V (See Block Diagram) - 500 - µA
PWM Rising Threshold V
PVCC
= 12V - 3.6 - V
PWM Falling Threshold V
PVCC
= 12V - 1.45 - V
UGATE Rise Time TR
UGATE
V
PVCC
= V
VCC
= 12V, 3nF Load - 20 - ns
LGATE Rise Time TR
LGATE
V
PVCC
= V
VCC
= 12V, 3nF Load - 50 - ns
UGATE Fall Time TF
UGATE
V
PVCC
= V
VCC
= 12V, 3nF Load - 20 - ns
LGATE Fall Time TF
LGATE
V
PVCC
= V
VCC
= 12V, 3nF Load - 20 - ns
UGATE Turn-Off Propagation Delay TPDL
UGATE
V
PVCC
= V
VCC
= 12V, 3nF Load - 30 - ns
LGATE Turn-Off Propagation Delay TPDL
LGATE
V
PVCC
= V
VCC
= 12V, 3nF Load - 20 - ns
Shutdown Window 1.4 - 3.6 V
Shutdown Holdoff Time - 230 - ns
OUTPUT
Upper Drive Source Impedance R
UGATE
V
VCC
= 12V, V
PVCC
= 5V - 1.7 3.0
V
VCC
= V
PVCC
= 12V - 3.0 5.0
Upper Drive Sink Impedance R
UGATE
V
VCC
= 12V, V
PVCC
= 5V - 2.3 4.0
V
VCC
= V
PVCC
= 12V - 1.1 2.0
Lower Drive Source Current I
LGATE
V
VCC
= 12V, V
PVCC
= 5V 400 580 - mA
V
VCC
= V
PVCC
= 12V 500 730 - mA
Lower Drive Sink Impedance R
LGATE
V
VCC
= 12V, V
PVCC
= 5V or 12V - 1.6 4.0
HIP6602B
6
FN9076.6
December 3, 2015
Functional Pin Descriptions
PWM1 (Pin 1) and PWM2 (Pin 2), (Pins 15 and 16
QFN)
The PWM signal is the control input for the driver. The PWM
signal can enter three distinct states during operation, see the
three-state PWM Input section under DESCRIPTION for further
details. Connect this pin to the PWM output of the controller.
GND (Pin 3), (Pin 1 QFN)
Bias and reference ground. All signals are referenced to
this node.
LGATE1 (Pin 4) and LGATE2 (Pin 7), (Pins 2 and
6QFN)
Lower gate drive outputs. Connect to gates of the low-side
power N-Channel MOSFETs.
PVCC (Pin 5), (Pin 3 QFN)
This pin supplies the upper and lower gate drivers bias.
Connect this pin from +12V down to +5V.
PGND (Pin 6), (Pin 4 QFN)
This pin is the power ground return for the lower gate
drivers.
PHASE2 (Pin 8) and PHASE1 (Pin 13), (Pins 7 and
13 QFN)
Connect these pins to the source of the upper MOSFETs
and the drain of the lower MOSFETs. The PHASE voltage is
monitored for adaptive shoot-through protection. These pins
also provide a return path for the upper gate drive.
UGATE2 (Pin 9) and UGATE1 (Pin 12), (Pins 9 and
12 QFN)
Upper gate drive outputs. Connect to gate of high-side
power N-Channel MOSFETs.
BOOT 2 (Pin 10) and BOOT 1 (Pin 11), (Pins 10 and
11 QFN)
Floating bootstrap supply pins for the upper gate drivers.
Connect a bootstrap capacitor between these pins and the
corresponding PHASE pin. The bootstrap capacitor provides
the charge to turn on the upper MOSFETs. A resistor in
series with boot capacitor is required in certain applications
to reduce ringing on the BOOT pin. See the Internal
Bootstrap Device section under DESCRIPTION for guidance
in choosing the appropriate resistor and capacitor value.
VCC (Pin 14), (Pin 14 QFN)
Connect this pin to a +12V bias supply. Place a high quality
bypass capacitor from this pin to GND. To prevent forward
biasing an internal diode, this pin should be more positive
then PVCC during converter start-up
Description
Operation
Designed for versatility and speed, the HIP6602B two channel,
dual MOSFET driver controls both high-side and low-side
N-Channel FETs from two externally provided PWM signals.
The upper and lower gates are held low until the driver is
initialized. Once the VCC voltage surpasses the VCC Rising
Threshold (See Electrical Specifications), the PWM signal
takes control of gate transitions. A rising edge on PWM
initiates the turn-off of the lower MOSFET (see Timing
Diagram). After a short propagation delay [TPDL
LGATE
], the
lower gate begins to fall. Typical fall times [TF
LGATE
] are
provided in the Electrical Specifications section. Adaptive
shoot-through circuitry monitors the LGATE voltage and
determines the upper gate delay time [TPDH
UGATE
] based
on how quickly the LGATE voltage drops below 2.2V. This
prevents both the lower and upper MOSFETs from
conducting simultaneously or shoot-through. Once this delay
period is complete the upper gate drive begins to rise
[TR
UGATE
] and the upper MOSFET turns on.
Timing Diagram.
PWM
UGATE
LGATE
TPDL
LGATE
TF
LGATE
TPDH
UGATE
TR
UGATE
TPDL
UGATE
TF
UGATE
TPDH
LGATE
TR
LGATE
HIP6602B

HIP6602BCBZ-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Gate Drivers LD VER OF HI6602BCB-
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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