SI5479DU-T1-GE3

Vishay Siliconix
Si5479DU
Document Number: 73368
S-81448-Rev. B, 23-Jun-08
www.vishay.com
1
P-Channel 12-V (D-S) MOSFET
FEATURES
Halogen-free
TrenchFET
®
Power MOSFET
New Thermally Enhanced PowerPAK
®
ChipFET
®
Package
- Small Footprint Area
- Low On-Resistance
- Thin 0.8 mm Profile
APPLICATIONS
Load Switch, PA Switch, and Battery Switch for Portable
Applications
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
a
Q
g
(Typ.)
- 12
0.021 at V
GS
= - 4.5 V
- 16.9
21 nC
0.028 at V
GS
= - 2.5 V
- 16
0.039 at V
GS
= - 1.8 V
- 16
Ordering Information: Si5479DU-T1-GE3 (Lead (Pb)-free and Halogen-free)
Marking Code
BB XXX
Lot Traceability
and Date Code
Part # Code
Bottom View
PowerPAK ChipFET Single
D
D
D
G
1
2
8
7
6
5
D
D
D
S
3
4
S
S
G
D
P-Channel MOSFE
T
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (
http://www.vishay.com/ppg?73257). The PowerPAK ChipFET is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 90 °C/W.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
- 12
V
Gate-Source Voltage
V
GS
± 8
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
- 16
a
A
T
C
= 70 °C
- 16
a
T
A
= 25 °C
- 10.3
b, c
T
A
= 70 °C
- 8.3
b, c
Pulsed Drain Current
I
DM
- 20
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
- 14.8
T
A
= 25 °C
- 2.6
b, c
Maximum Power Dissipation
T
C
= 25 °C
P
D
17.8
W
T
C
= 70 °C
11.4
T
A
= 25 °C
3.1
b, c
T
A
= 70 °C
2
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
d, e
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, f
t 5 s
R
thJA
30 40
°C/W
Maximum Junction-to-Case (Drain) Steady State
R
thJC
5.5 7
RoHS
COMPLIANT
www.vishay.com
2
Document Number: 73368
S-81448-Rev. B, 23-Jun-08
Vishay Siliconix
Si5479DU
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= - 250 µA
- 12 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= - 250 µA
- 10.3
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
2.6
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 0.4 - 1.0 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 8 V
± 100 ns
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 12 V, V
GS
= 0 V
- 1
µA
V
DS
= - 12 V, V
GS
= 0 V, T
J
= 55 °C
- 10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= - 4.5 V
- 20 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= - 4.5 V, I
D
= - 6.9 A
0.017 0.021
Ω
V
GS
= - 2.5 V, I
D
= - 6 A
0.023 0.028
V
GS
= - 1.8 V, I
D
= - 2.6 A
0.032 0.039
Forward Transconductance
a
g
fs
V
DS
= - 6 V, I
D
= - 6.9 A
24 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= - 6 V, V
GS
= 0 V, f = 1 MHz
1810
pFOutput Capacitance
C
oss
640
Reverse Transfer Capacitance
C
rss
490
Total Gate Charge
Q
g
V
DS
= - 6 V, V
GS
= - 8 V, I
D
= - 6.9 A
34 51
nC
V
DS
= - 6 V, V
GS
= - 4.5 V, I
D
= - 6.9 A
21 32
Gate-Source Charge
Q
gs
3.1
Gate-Drain Charge
Q
gd
6
Gate Resistance
R
g
f = 1 MHz 9.1 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 6 V, R
L
= 0.7 Ω
I
D
- 8.3 A, V
GEN
= - 4.5 V, R
g
= 1 Ω
12 20
ns
Rise Time
t
r
35 55
Turn-Off Delay Time
t
d(off)
76 115
Fall Time
t
f
115 175
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 6 V, R
L
= 0.7 Ω
I
D
- 8.3 A, V
GEN
= - 8 V, R
g
= 1 Ω
612
Rise Time
t
r
13 20
Turn-Off Delay Time
t
d(off)
77 115
Fall Time
t
f
100 150
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
- 14.9
A
Pulse Diode Forward Current
I
SM
- 20
Body Diode Voltage
V
SD
I
S
= - 8.6 A, V
GS
= 0 V
- 0.9 - 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= - 8.6 A, dI/dt = 100 A/µs, T
J
= 25 °C
55 90 ns
Body Diode Reverse Recovery Charge
Q
rr
28 45 nC
Reverse Recovery Fall Time
t
a
19
ns
Reverse Recovery Rise Time
t
b
36
Document Number: 73368
S-81448-Rev. B, 23-Jun-08
www.vishay.com
3
Vishay Siliconix
Si5479DU
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
4
8
12
16
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0
V
GS
= 5 thru 2 V
1.5 V
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
1 V
0.00
0.02
0.04
0.06
0.08
0.10
048 12 16 20
V
GS
= 2.5 V
I
D
- Drain Current (A)
V
GS
= 4.5 V
R
DS(on)
- On-Resistance (mΩ)
V
GS
= 1.8 V
0
1
2
3
4
5
6
7
8
0 5 10 15 20 25 30 35
I
D
= 6.9 A
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
= 6 V
V
DS
= 9.6 V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
2
4
6
8
10
0.0 0.4 0.8 1.2 1.6 2.0
25 °C
T
C
= 125 °C
- 55 °C
V
GS
- Gate-to-Source Voltage (V)
-Drain Current (A)I
D
0
500
1000
1500
2000
2500
3000
02468 10 12
C
rss
C
oss
C
iss
V
DS
- Drain-to-Source Voltage (V)
C
-
Capacitance (pF)
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
- 50 - 25 0 25 50 75 100 125 150
V
GS
= 4.5, 2.5, 1.8 V
I
D
= 6.9 A
T
J
- Junction Temperature (°C)
R
DS(on)
- On-Resistance
(Normalized)

SI5479DU-T1-GE3

Mfr. #:
Manufacturer:
Vishay
Description:
MOSFET P-CH 12V 16A CHIPFET
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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