USB3740B
DS00001725D-page 10 2011 - 2015 Microchip Technology Inc.
FIGURE 6-2: 10-PIN, 1.3MM X 1.8MM QFN PACKAGE DIMENSIONS
Microchip Technology Drawing C04-386A Sheet 2 of 2
Number of Terminals
Overall Height
Terminal Width
Overall Width
Overall Length
Terminal Length
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
A3
e
L
E
N
0.40 BSC
0.127 REF
0.35
0.15
0.50
0.00
0.20
1.30 BSC
0.40
0.55
0.02
1.80 BSC
MILLIMETERS
MIN
NOM
10
0.45
0.25
0.60
0.05
MAX
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Terminal Length L1 0.45 0.50 0.55
10-Lead Ultra Thin Plastic Quad Flat, No Lead Package (2V) - 1.3x1.8x0.6 mm Body
[UQFN] Chip-On-Lead
2011 - 2015 Microchip Technology Inc. DS00001725D-page 11
USB3740B
FIGURE 6-3: 10-PIN, 1.3MM X 1.8MM QFN PACKAGE LAND PATTERN
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2Contact Pad Spacing
Contact Pitch
MILLIMETERS
0.40 BSC
MIN
E
MAX
1.70
Contact Pad Length (X4)
Contact Pad Width (X10)
Y2
X
0.80
0.20
Microchip Technology Drawing C04-2386A
NOM
SILK SCREEN
1
2
20
C1Contact Pad Spacing 1.10
Contact Pad to Pad (X4) G2 0.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M1.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
C1
C2
Y2
Y1
G2
G1
E
X
Contact Pad Length (X6) Y1 0.70
Contact Pad to Pad (X6) G1 0.20
10-Lead Ultra Thin Plastic Quad Flat, No Lead Package (2V) - 1.3x1.8x0.6 mm Body
[UQFN] Chip-On-Lead
USB3740B
DS00001725D-page 12 2011 - 2015 Microchip Technology Inc.
6.2 1.6mm x 2.1mm QFN
FIGURE 6-4: 10-PIN, 1.6MM X 2.1MM QFN PACKAGE OUTLINE
B
A
0.10
C
0.10 C
0.10 C A B
0.05 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
NOTE 1
1
2
N
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 1
1
2
N
0.10
C
0.08
C
Microchip Technology Drawing C04-381A Sheet 1 of 2
10-Lead Ultra Thin Plastic Quad Flat, No Lead Package (3V) - 1.6.x2.1 mm Body [UQFN
2X
10X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
D
E
A
(A3)
A1
e
e
K1
6X L1
4x L2
K2
10X b
Chip-On-Lead

USB3740B-AI9-TR

Mfr. #:
Manufacturer:
Microchip Technology
Description:
USB Switch ICs USB 2.0 SWITCH
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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