2011 - 2015 Microchip Technology Inc. DS00001725D-page 7
USB3740B
4.0 GENERAL OPERATION
The USB3740B is a high bandwidth switch suitable for many applications, including High Speed USB. The mux allows
high speed signals to pass through and still meet HS USB signaling requirements.
The USB3740B will protect the system from ESD stress events on all DP and DM pins. The USB3740B provides ESD
protection to the IEC-61000 ESD specification.
The USB mux is designed to pass High Speed USB signals to the USB connector, and allows for two USB inputs to be
multiplexed into one USB output.
The USB Mux is designed to pass USB signals from 0 to VDD. It is not designed to pass signals that go above VDD or
below ground.
The USB3740B switches are controlled by the digital signals OE_N and S, as shown in Table 4-1.
TABLE 4-1: USB3740B SWITCH STATES DEFINITION
OE_N S Switch State
1 X STANDBY:
Both switch paths disconnected.
Lowest power state
0 0 DP = DP1, DM = DM1:
0 1 DP = DP2, DM = DM2:
USB3740B
DS00001725D-page 8 2011 - 2015 Microchip Technology Inc.
5.0 APPLICATION NOTES
5.1 ESD Performance
The USB3740B is protected from ESD strikes. By eliminating the requirement for external ESD protection devices,
board space is conserved, and the board manufacturer is enabled to reduce cost. The advanced ESD structures inte-
grated into the USB3740B protect the device whether or not it is powered up.
5.1.1 HUMAN BODY MODEL (HBM) PERFORMANCE
HBM testing verifies the ability to withstand the ESD strikes like those that occur during handling and manufacturing,
and is done without power applied to the IC. To pass the test, the device must have no change in operation or perfor-
mance due to the event. The USB3740B HBM performance is detailed in Table 3-1.
2011 - 2015 Microchip Technology Inc. DS00001725D-page 9
USB3740B
6.0 PACKAGE OUTLINES
6.1 1.3mm x 1.8mm QFN
FIGURE 6-1: 10-PIN, 1.3MM X 1.8MM QFN PACKAGE OUTLINE
B
A
0.10
C
0.10 C
0.07 C A B
0.05 C
(DATUM B)
(DATUM A)
C
SEATING
PLANE
NOTE 1
1
2
N
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 1
1
2
N
0.10
C
0.08 C
Microchip Technology Drawing C04-386A Sheet 1 of 2
2X
10X
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
10-Lead Ultra Thin Plastic Quad Flat, No Lead Package (2V) - 1.3x1.8x0.6 mm Body
[UQFN] Chip-On-Lead
D
E
e
6X L
10X b
A
(A3)
A1
4X L1

USB3740B-AI9-TR

Mfr. #:
Manufacturer:
Microchip Technology
Description:
USB Switch ICs USB 2.0 SWITCH
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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