BYV25FX-600 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 02 — 7 March 2011 4 of 11
NXP Semiconductors
BYV25FX-600
Enhanced ultrafast power diode
5. Thermal characteristics
6. Isolation characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-h)
thermal resistance from
junction to heatsink
with heatsink compound;
see Figure 4
--5.5K/W
R
th(j-a)
thermal resistance from
junction to ambient
in free air - 55 - K/W
Fig 4. Transient thermal impedance from junction to heatsink as a function of pulse width
001aaf257
10
−2
10
−1
1
10
Z
th(j-h)
(K/W)
10
−3
t
p
(s)
10
−6
10110
−1
10
−5
10
−3
10
−2
10
−4
t
p
t
p
T
P
t
T
δ =
Table 6. Isolation characteristics
Symbol Parameter Conditions Min Typ Max Unit
V
isol(RMS)
RMS isolation voltage 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; from all
pins to external heatsink; sinusoidal
waveform; clean and dust free
- - 2500 V
C
isol
isolation capacitance f = 1 MHz; from cathode to external
heatsink
-10-pF