LTM8025
19
8025fc
For more information www.linear.com/LTM8025
package DescripTion
BGA Package
70-Lead (15mm × 9mm × 4.92mm)
(Reference LTC DWG# 05-08-1918 Rev A)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
BALL DESIGNATION PER JESD MS-028 AND JEP95
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
4
3
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DETAIL A
Øb (70 PLACES)
DETAIL B
SUBSTRATE
A
A1
b1
ccc Z
DETAIL B
PACKAGE SIDE VIEW
MOLD
CAP
Z
M
X YZddd
M
Zeee
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
4.72
0.50
4.22
0.60
0.60
0.27
3.95
NOM
4.92
0.60
4.32
0.75
0.63
15.00
9.00
1.27
12.70
7.62
0.32
4.00
MAX
5.12
0.70
4.42
0.90
0.66
0.37
4.05
0.15
0.10
0.20
0.30
0.15
NOTES
DIMENSIONS
TOTAL NUMBER OF BALLS: 70
A2
// bbb Z
Z
H2
H1
BGA 70 1212 REV A
SUGGESTED PCB LAYOUT
TOP VIEW
0.000
2.540
3.810
5.080
6.350
1.270
3.810
2.540
1.270
5.080
6.350
3.810
2.540
1.270
3.810
2.540
1.270
0.3175
0.3175
0.000
0.630 ±0.025 Ø 70x
PACKAGE TOP VIEW
4
PIN “A1”
CORNER
Y
X
aaa Z
aaa Z
D
E
DETAIL A
PACKAGE BOTTOM VIEW
3
SEE NOTES
A
B
C
D
E
F
G
H
J
K
L
PIN 1
e
b
F
G
7 6 5 4 3 2 1
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
COMPONENT
PIN “A1”
LTMXXXXXX
µModule
7 PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
!
7
SEE NOTES
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.