Technical Terminology & Cautions for Use
–2–
AECTB36E 201510-T
OPERATING CHARACTERISTIC
TECHNICAL NOTES ON MECHANICAL CHARACTERISTICS
Definition of operating characteristic
The main terminological illustrations and
meanings which are used with snap-
action switches are as follows.
Center of mounting holes
FP
OF
RF
TT
MD
OT
TTP
OP
PT TF
RP
Classification Terminology Symbol Unit
Varying
display
method
Starting current
Force
Operating
Force
OF N Max.
The force required to cause contact snap-action. It
is expressed terms of force applied to the the
actuator.
Release
Force
RF N Min.
The force to be applied to the the actuator at the
moment contact snaps back from operated
position to total travel position.
Totaltravel
Force
TF N
Force applied to an actuator required to move from
an operating position to a total travel position
Movement
Pretravel PT
mm,
degree
Max.
Distance or agree of the actuator movement from
free position to operating position.
Overtravel OT
mm,
degree
Min.
The distance or degree which the actuator is
permitted to travel after actuation without any
damage to the switching mechanism.
Movement
Differential
MD
mm,
degree
Max.
The distance or degree from operating position to
release position of the actuator.
Totaltravel TT
mm,
degree
The migration length or the move angle from the
free position to total travel position of actuator
Position
Free
Position
FP
mm,
degree
Position of the actuator when no force is applied
to.
Operating
Position
OP
mm,
degree
±
The position of the actuator when the traveling
contacts snaps with the fixed contact.
Release
Position
RP
mm,
degree
The position of the actuator when the traveling
contact snaps back from operating position to its
original position.
Total travel
Position
TTP
mm,
degree
The stopping position of the actuator after total
travel.
Actuation Force and Stroke
Adequate stroke setting is the key to high reliability. It is also
important that adequate contact force be ’maintained to ensure
high reliability. For a normally closed (NC) circuit, the driving
mechanism should be set so that the actuator is normally in the
free position. For a normally open (NO) circuit, the actuator
should be pressed to 70% to 100% of the specified stroke to
absorb possible errors.
If the stroke is set too close to the operating point (OP), this may
cause unstable contact, and in the worst case may cause
actuator damage due to inertia of the drive mechanism. It is
advisable that the stroke be adjusted with the mounting plate or
driving mechanism.
The figure at right
shows a typical
example of activation
and contact forces
varying with stroke.
In the vicinity of the
OP and RP, the
contact force is
diminished, causing
chatter and contact
bounce immediately
before or after
reversal. For this
reason, use the
switch while giving
due consideration to
this. This also causes
the snap action
switch to be sensitive
to vibration or shock.
Changes in Operating Characteristics
Exercise design care so that malfunctions will not occur if the
operating characteristics vary by as much as 20% from, rated
values.
<Example>
In the OF max. 0.98N specification for FS snap-action switches,
the allowable max. is 0.98 N × (100%+20%) = 1.18 N
In the RF min. 0.15 N min. specification
the allowable min. 0.15 N × (100%–20%) = 0.12 N
Mechanical Conditions for Type Selection
Actuator type should be selected according to activation
method, activation speed, activation rate, and activation
frequency.
1) An extremely slow activation speed may cause unstable
contact transfer, possibly resulting in contact failures or contact
fusion.
2) An extremely high activation speed may cause damage to
contacts or contact response failure.
Driving Mechanism
Use of a driving mechanism which will cause physical impact to
the actuator should be avoided.
<Example>
Bad
Good
OF
RF
PT
NC
On FP
On reversal
On reversal
On OTP
NO
Stroke
Stroke
MD
OT
FP RP
OP
TTP
Contact force Operating force
Technical Terminology & Cautions for Use
–3–
AECTB36E 201510-T
TECHNICAL NOTES ON ELECTRICAL CHARACTERISTICS
CAUTIONS IN A CIRCUIT
1) The snap-action switch is designed for AC operations. While it
has small contact gaps and no arc absorber, it may be used for
low-capacity DC operations.
Please refer to the rating of each products
2) For applications with very small switching voltage or current,
choose the low-level load type (Au contact).
3) When selecting a contact type of a snap-action switch to be
used for low-level load switching, the following should be noted.
Silver contacts’ surfaces are prone to be oxidized and form a
sulfide film. The switch operates with no problems at the
beginning of use. However, as the contact surfaces develop films
with time, the film may not be broken by the switching operation,
causing a conduction failure. Therefore, please choose the Au
contact type for switching a load of 0.1 A or below.
4) Application to Electronic Circuits
The snap-action switch contacts can sustain bounce or chatter
when closed. Bounce or chatter can cause noise or pulse count
errors when the snap action switch is used in electronic circuits.
• If contact bounce or chatter poses problems in the vicinity of
the OP and RP, use a suitable absorption network, such as a C/
R network.
5) Check the surge current, normal current and surge duration.
6) Contact resistance given in performance specifications is
measured with a voltage drop method using 6 to 8 V DC, 1 A
(except for low-level load type). Contact resistance across COM
and NC terminals is measured in the free position, while contact
resistance across COM and NO terminals is measured in the
total travel position.
7) Ratings are measured under the following conditions:
Inductive load: Power factor 0.6 to 0.7
Time constant: 7 ms or less (DC)
8) To prevent contact welding failure, be sure to use a serial
resistance for each capacitive load.
9) If snap-action switch operation is synchronized with the AC
supply phase, this may cause: shortened electrical life, contact
fusion failure, contact transfer, or other reliability problems.
Small current and voltage application range (Au contact)
500
100
50
5
2
1
4 8 12 16 20 24
10
DC voltage (VDC)
Current (mA)
1) Contact protection is recommended when snap-action
switches are used in an inductive load circuit.
2) Do not connect the
contacts on individual
switches to different
type or different poles of
the power supply.
Examples of power
supply connections
(connection to different
poles)
Example of wrong
power supply
connection (connection
to different poles of
power supply)
This may lead to mixed
DC and AC.
3) Avoid circuits which
apply voltage between
contacts. (This may lead
to mixed deposition.)
Circuit diagram Cautions for use
Contact for snap-action switch
(1) r = more than 10 Ω
(2) In an AC circuit
Impedance of R is to be slightly smaller
than impedance of r and c.
Contact for snap-action switch
Can be used for both AC and DC.
Impedance of r is nearly equal to
impedance of R.
C: 0.1 μF
Contact for snap-action switch
(1) For DC circuits only.
Contact for snap-action switch
Can be used for both AC and DC.
rc
R
r
c
R
R
diode
R
ZNR
Varistor
PL
Wrong
Solenoid load
Lamp load
PL
Right
Solenoid load
Lamp load
Load connected to same pole
L
Load
L
Load
AC
DC
Wrong
Wrong
L
100V
200V
Technical Terminology & Cautions for Use
–4–
AECTB36E 201510-T
MOUNTING STATE AND ENVIRONMENT
Checking the insulation distance
After mounting and wiring, check the insulation distance
between terminals and the ground. If the insulation distance is
inadequate, mount insulating material between as required.
Fastening the snap-action switch body
See the Section “CAUTIONS FOR USE” for the individual
switch.
Position adjustment with effector
1) The effector should be positioned so that direct force is not
applied to the plunger or actuator in its free position. The
operating force to the plunger should only be applied in a
perpendicular direction.
2) Note that the use of the switch as a stopper may cause an
operational problem.
Switch installation position
• Basically, the switch should be installed so that the object to
press the switch’s plunger or lever can press it down to 70 to
100% of OT of the switch. When determining the position, the
tolerance of OP (Operating Position) and other factors should be
taken into account.
The following describes the case where the strictest tolerance
conditions are adopted.
• Example: Hinge lever type FS switch
Soldering precautions
For manual soldering, lay the terminals flat (horizontal with the
ground) and quickly perform the soldering operation using a
soldering iron with the appropriate heat capacity and the proper
amount of solder. Take care that the flux does not flow into the
switch interior by using a ventilation fan to discharge flux gas
and to prevent contact of the switch body with the soldering iron
tip.
Be careful not to apply force to the lead wires or the terminal
portions immediately after soldering.
The temperature setting and time conditions vary depending on
the product.
See the section “CAUTIONS FOR USE” for each product.
Avoid using in a silicon atmosphere
Avoid using organic silicon rubber, adhesives, sealing
compounds, oil, grease, and wires in a silicon atmosphere.
Please consult us when using under the following
conditions*:
1) Environments where hydrogen sulfide or other corrosive
gases are present.
2) Environments where gasoline, thinner or other flammable,
explosive gases are present.
3) Dusty environments (for non-seal type snap action switches).
4) The perpendicular operating speed exceeds the allowable
operating speed.
5) Switching between different poles.
6) Use in environments not in the prescribed temperature or
humidity range.
Storage precautions
To prevent discoloration due to sulfurization of the terminals
(silver- plated), store the switches in a polyethylene bag or other
suitable airtight container.
(1) When the switch is not pressed
The object to press the lever should not be in contact with
the lever.
For this purpose, the object should be at a distance from
the switch father than the maximum FP (Free Position)
value.
FP max = OP max + PT max = 9.6 + 2.8 = 12.4 mm max
The object should be at a distance of 12.4 mm or more
from the mounting hole.
(2) Depressed position
The plunger/lever should be pressed down to 70% or
more of OT (Over Travel). Therefore, the depressed
position should be calculated based on the minimum
value of OP (Operating Position) and the 70 and 100% of
the OT value.
OP min - 70% of OT = 8.0 - 0.84 = 7.16 mm
OP min - 100% of OT = 8.0 - 1.2 = 6.80 mm
The plunger/lever should be pressed down to the position
of 6.80 to 7.16 mm from the mounting hole.
FP
OP PT
TTP OT
Reference values: OP = 8.8±0.8mm
PT = max. 2.8mm
OT = min. 1.2mm
<Examples>
Soldering iron tip
Wrong
Correct

AH14649-A

Mfr. #:
Manufacturer:
Panasonic
Description:
Basic / Snap Action Switches SPDT Hinge Simulated Roller Lever, PCB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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