BLA2AAG221SN4D

Spec. No. JENF243A–0016Q-01 P 7/ 8
MURATA MFG CO., LTD.
Reference
Onl
y
12.4. Solder Volume
Solder shall be used not to be exceeded as shown below.
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
12.5. Attention regarding P.C.B bending
The following shall be considered when designing and laying out P.C.B.’s
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
Products shall be locatedin the sideways
direction (Length : a < b) to the mechanical
stress.
(2) Products location on P.C.B. separation.
Products shall be cleaned on the following conditions.
so that products are not subject to the
mechanical stress due to warping the board.
Because the may be subjected the mechanical
stress in order of A > C > B D.
12.6. Potential between Elements
Products should be used within 5 V(DC) between elements.
When the products are used the excessive voltage over 5 V(DC) , it may cause breaking of inner electrade
and / or decreasing o insulation resistance between elements.
12.7. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
12.8. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60 °C max. (40 °C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B
Power : 20 W / l max. Frequency : 28 kHz to 40 kHz Time : 5 min max.
(3) Cleaner
1. Cleaner
· Isopropyl alcohol (IPA)
2. Aqueous agent
· PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinese with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
Poor example
Good example
b
a
Seam
Slit
A
D
B
C
b
a
Lengh:a<b
Recommendabl
Upper Limit
t
1/3T
t
T
(T:Chip thickness)
Spec. No. JENF243A–0016Q-01 P 8/ 8
MURATA MFG CO., LTD.
Reference
Onl
y
12.9.Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
12.10. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation Resistance of
the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
12.11. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of resin
to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to use,
please make the reliability evaluation with the product mounted in your application set.
12.12. Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage coditions
· Products should be stored in the warehouse on the following conditions.
Temperature : - 10 °C to 40 °C
Humidity
: 15 % to 85 % relative humidity
No rapid change on temperature and humidity
· Don’t keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
· Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
13. ! Notes
(1) Please make sure that your product has been evaluated in view of your specifications with our product
being mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

BLA2AAG221SN4D

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Ferrite Beads BLA2AAG221SN4D
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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