PESD5V0U5BF_PESD5V0U5BV_1 © NXP B.V. 2008. All rights reserved.
Product data sheet Rev. 01 — 15 August 2008 7 of 12
NXP Semiconductors
PESD5V0U5BF; PESD5V0U5BV
Ultra low capacitance bidirectional fivefold ESD protection arrays
7. Application information
The PESD5V0U5BF and the PESD5V0U5BV are designed for the protection of up to five
bidirectional data or signal lines from the damage caused by ESD and surge pulses. The
devices may be used on lines where the signal polarities are both, positive and negative
with respect to ground.
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the device as close to the input terminal or connector as possible.
2. The path length between the device and the protected line should be minimized.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Ground planes should be used whenever possible. For multilayer PCBs, use ground
vias.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard
Q101 - Stress test qualification for discrete semiconductors
, and is
suitable for use in automotive applications.
Fig 5. Application diagram
006aab347
data- or transmission lines
DUT
1
2
3
5
4
6
