Philips Semiconductors
SC16C554/554D
Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
Product data Rev. 05 — 10 May 2004 52 of 55
9397 750 13132
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
Philips Semiconductors
SC16C554/554D
Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
Product data Rev. 05 — 10 May 2004 53 of 55
9397 750 13132
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
13. Revision history
Table 29: Revision history
Rev Date CPCN Description
05 20040510 - Product data (9397 750 13132). Supersedes data of 19 June 2003 (9397 750 11616).
Modifications:
Figure 6 “LQFP80 pin configuration.: change pin 49 from “CSC” to “n.c.”; change pin 74
from “D6” to “INTD”.
Table 2 “Pin description”
INTSEL description, last sentence: change from “The ST16C654IB64 ...” to “The
SC16C654IB64 ...
RESET (RESET) description, last sentence: change from “... this pin functions similarly,
bus as an inverted reset interface signal ...” to “... this pin functions similarly, but as an
inverted reset interface signal ...
Section 6.4 “Internal registers”, first sentence: change from “... provides 15 internal
registers...” to “... provides 17 internal registers...
Section 6.13 “Loop-back mode”
First paragraph:
change from “MCR signals
DTR and RTS (bits 0-1) are used to control the modem
CTS and DSR inputs, respectively.” to “MCR signals DTR and RTS (bits 0-1) are used
to control the modem
DSR and CTS inputs, respectively.
Change from “...are connected internally to
DTR, RTS, OP1 and OP2.” to “...are
connected internally to
RTS, DTR, OP2 and OP1.
Figure 8 and Figure 9 modified: signals to/from Modem Control Logic block corrected.
Table 9 “Interrupt Enable Register bits description”: description of bit 2, IER[2], modified.
Table 21 “Enhanced Feature Register bits description”: description of bit 6, EFR[6], and of
bit 4, EFR[4], modified.
04 20030619 - Product data (9397 750 11616); ECN 853-2376 30028 of 16 June 2003.
03 20030415 - Product data (9397 750 11375); ECN 853-2376 29797 of 11 April 2003.
02 20030313 - Product data (9397 750 11002); ECN 853-2376 29627 of 10 March 2003.
01 20020910 - Product data; (9397 750 09213); ECN 853-2376 28891 of 10 September 2002.
9397 750 13132
Philips Semiconductors
SC16C554/554D
Quad UART with 16-byte FIFO and infrared (IrDA) encoder/decoder
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data Rev. 05 — 10 May 2004 54 of 55
Contact information
For additional information, please visit http://www.semiconductors.philips.com.
For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com. Fax: +31 40 27 24825
14. Data sheet status
[1] Please consult the most recently issued data sheet before initiating or completing a design.
[2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
15. Definitions
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
16. Disclaimers
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Level Data sheet status
[1]
Product status
[2][3]
Definition
I Objective data Development This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).

SC16C554IB80,557

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC UART QUAD 80LQFP
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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