FDD4243-F085P

FDD4243-F085 P-Channel PowerTrench
®
MOSFET
www.onsemi.com
4
Typical Characteristics
Figure 1. Normalized Power Dissipation vs Case
Temperature
Figure 2. Maximum Continuous Drain Current vs
Case Temperature
Figure 3. Normalized Maximum Transient Thermal Impedance
Figure 4. Peak Current Capability
0 25 50 75 100 125 150 175
0.0
0.2
0.4
0.6
0.8
1.0
1.2
POWER DISSIPATION MULTIPLIER
T
C
, CASE TEMPERATURE(
o
C)
25 50 75 100 125 150 175
0
10
20
30
CURRENT LIMITED
BY PACKAGE
R
JC
= 3
o
C/W
V
GS
= -4.5V
V
GS
= -10V
-I
D
, DRAIN CURRENT (A)
T
C
, CASE TEMPERATURE (
o
C)
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0.001
0.01
0.1
1
SINGLE PULSE
D = 0.50
0.20
0.10
0.05
0.02
0.01
NORMALIZED THERMAL
IMPEDANCE, Z
JC
t, RECTANGULAR PULSE DURATION(s)
DUTY CYCLE - DESCENDING ORDER
2
NOTES:
DUTY FACTOR: D = t
1
/t
2
PEAK T
J
= P
DM
x Z
JA
x R
JA
+ T
A
P
DM
t
1
t
2
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
100
1000
V
GS
= 10V
SINGLE PULSE
-I
DM
, PEAK CURRENT (A)
t, RECTANGULAR PULSE DURATION(s)
T
C
= 25
o
C
I = I
25
175 - T
C
150
FOR TEMPERATURES
ABOVE 25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
FDD4243-F085 P-Channel PowerTrench
®
MOSFET
www.onsemi.com
5
Figure 5. Forward Bias Safe Operating Area
NOTE: Refer to ON Semiconductor Application Notes AN7514
and AN7515
Figure 6. Unclamped Inductive Switching
Capability
Figure 7. Transfer Characteristics Figure 8. Saturation Characteristics
Figure 9. Drain to Source On-Resistance
Variation vs Gate to Source Voltage
Figure 10. Normalized Drain to Source On
Resistance vs Junction Temperature
Typical Characteristics
11090
0.1
1
10
100
300
100us
1ms
10ms
-I
D
, DRAIN CURRENT (A)
-V
DS
, DRAIN TO SOURCE VOLTAGE (V)
OPERATION IN THIS
AREA MAY BE
LIMITED BY r
DS(on)
SINGLE PULSE
T
J
= MAX RATED
T
C
= 25
o
C
DC
10.1110100
1
10
40
STARTING T
J
= 150
o
C
STARTING T
J
= 25
o
C
-I
AS
, AVALANCHE CURRENT (A)
t
AV
, TIME IN AVALANCHE (ms)
t
AV
= (L)(I
AS
)/(1.3*RATED BV
DSS
- V
DD
)
If R = 0
If R

0
t
AV
= (L/R)ln[(I
AS
*R)/(1.3*RATED BV
DSS
- V
DD
) +1]
0123456
0
10
20
30
40
50
60
T
J
= -55
o
C
T
J
= 25
o
C
T
J
= 175
o
C
PULSE DURATION = 80s
DUTY CYCLE = 0.5% MAX
V
DD
= -5V
-I
D
, DRAIN CURRENT (A)
-V
GS
, GATE TO SOURCE VOLTAGE (V)
01234
0
10
20
30
40
50
60
V
GS
= -5V
V
GS
= -3V
V
GS
= -4V
V
GS
= -4.5V
V
GS
= -6V
V
GS
= -10V
PULSE DURATION = 80s
DUTY CYCLE = 0.5% MAX
-V
DS
, DRAIN TO SOURCE VOLTAGE (V)
-I
D
, DRAIN CURRENT (A)
246810
20
40
60
80
100
120
140
160
180
200
I
D
= -6.7A
PULSE DURATION = 80s
DUTY CYCLE = 0.5% MAX
r
DS(on)
, DRAIN TO SOURCE
ON-RESISTANCE
(m)
-V
GS
, GATE TO SOURCE VOLTAGE (V)
T
J
= 25
o
C
T
J
= 175
o
C
-80 -40 0 40 80 120 160 200
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
PULSE DURATION = 80s
DUTY CYCLE = 0.5% MAX
I
D
= -6.7A
V
GS
= -10V
NORMALIZED
DRAIN TO SOURCE ON-RESISTANCE
T
J
, JUNCTION TEMPERATURE(
o
C)
FDD4243-F085 P-Channel PowerTrench
®
MOSFET
www.onsemi.com
6
Figure 11. Normalized Gate Threshold Voltage vs
Junction Temperature
Figure 12. Normalized Drain to Source
Breakdown Voltage vs Junction Temperature
Figure 13. Capacitance vs Drain to Source
Voltage
Figure 14. Gate Charge vs Gate to Source Voltage
Typical Characteristics
-80 -40 0 40 80 120 160 200
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
V
GS
= V
DS
I
D
= -250A
NORMALIZED GATE
THRESHOLD VOLTAGE
T
J
, JUNCTION TEMPERATURE(
o
C)
-80 -40 0 40 80 120 160 200
0.90
0.95
1.00
1.05
1.10
1.15
I
D
= -250A
NORMALIZED DRAIN TO SOURCE
BREAKDOWN VOLTAGE
T
J
, JUNCTION TEMPERATURE (
o
C)
0.1 1 10 100
10
100
1000
5000
f = 1MHz
V
GS
= 0V
C
rss
C
oss
C
iss
CAPACITANCE (pF)
-V
DS
, DRAIN TO SOURCE VOLTAGE (V)
0 4 8 12162024
0
2
4
6
8
10
V
DD
= -30V
V
DD
= -10V
-V
GS
, GATE TO SOURCE VOLTAGE(V)
Q
g
, GATE CHARGE(nC)
V
DD
= -20V

FDD4243-F085P

Mfr. #:
Manufacturer:
ON Semiconductor / Fairchild
Description:
MOSFET 40V P-Channel Power Trench Mosfet
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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