TFDU4300
Document Number 82614
Rev. 1.8, 19-Feb-09
Vishay Semiconductors
www.vishay.com
209
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irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
Recommended Circuit Diagram
Operated with a clean low impedance power supply
the TFDU4300 needs no additional external
components. However, depending on the entire
system design and board layout, additional
components may be required (see figure 1).
*) R1 is optional when reduced intensity is used
The capacitor C1 is buffering the supply voltage and
eliminates the inductance of the power supply line.
This one should be a Tantalum or other fast capacitor
to guarantee the fast rise time of the IRED current.
The resistor R1 is the current limiting resistor, which
may be used to reduce the operating current to levels
below the specified controlled values for saving
battery power.
Vishay’s transceivers integrate a sensitive receiver
and a built-in power driver. The combination of both
needs a careful circuit board layout. The use of thin,
long, resistive and inductive wiring should be avoided.
The shutdown input must be grounded for normal
operation, also when the shutdown function is not
used.
Table 1.
Recommended Application Circuit
Components
The inputs (TXD, SD) and the output RXD should be
directly connected (DC - coupled) to the I/O circuit.
The capacitor C2 combined with the resistor R2 is the
low pass filter for smoothing the supply voltage.
R2, C1 and C2 are optional and dependent on the
quality of the supply voltages VCC1 and injected
noise. An unstable power supply with dropping
voltage during transmision may reduce the sensitivity
(and transmission range) of the transceiver.
The placement of these parts is critical. It is strongly
recommended to position C2 as close as possible to
the transceiver pins.
When extended wiring is used as in bench tests the
inductance of the power supply can cause
dynamically a voltage drop at VCC2. Often some
power supplies are not able to follow the fast current
rise time. In that case another 4.7 µF (type, see table
under C1) at VCC2 will be helpful.
Under extreme EMI conditions as placing an
RF-transmitter antenna on top of the transceiver, we
recommend to protect all inputs by a low-pass filter,
as a minimum a 12 pF capacitor, especially at the
RXD port. The transceiver itself withstands EMI at a
GSM frequencies above 500 V/m. When interference
is observed, the wiring to the inputs picks it up. It is
verified by DPI measurements that as long as the
interfering RF - voltage is below the logic threshold
levels of the inputs and equivalent levels at the
outputs no interferences are expected.
One should keep in mind that basic RF - design rules
for circuits design should be taken into account.
Especially longer signal lines should not be used
without termination. See e.g. “The Art of Electronics”
Paul Horowitz, Winfield Hill, 1989, Cambridge
University Press, ISBN: 0521370957.
Figure 1. Recommended Application Circuit
19295
V
IRED
V
CC
GND
V
logic
SD
TXD
RXD
V
CC2
, IRED A
V
CC1
Ground
V
logic
SD
TXD
RXD
IRED C
R2
R1*)
C1
C2
Component Recommended value Vishay part number
C1 4.7 µF, 16 V 293D 475X9 016B
C2 0.1 µF, Ceramic VJ 1206 Y 104 J XXMT
R1 depends on current to
be adjusted
R2 47 Ω, 0.125 W CRCW-1206-47R0-F-RT1