TFDU4300
Document Number 82614
Rev. 1.8, 19-Feb-09
Vishay Semiconductors
www.vishay.com
211
For technical questions within your region, please contact one of the following:
irdasupportAM@vishay.com, irdasupportAP@vishay.com, irdasupportEU@vishay.com
Recommended Solder Profiles
Solder Profile for Sn/Pb Soldering
Lead (Pb)-free, Recommended Solder Profile
The TFDU4300 is a lead (Pb)-free transceiver
and qualified for lead (Pb)-free processing. For
lead (Pb)-free solder paste like Sn
(3.0-4.0)
Ag
(0.5-0.9)
Cu, there are two standard reflow profiles: Ramp-
Soak-Spike (RSS) and Ramp-To-Spike (RTS). The
Ramp-Soak-Spike profile was developed primarily for
reflow ovens heated by infrared radiation. With wide-
spread use of forced convection reflow ovens the
Ramp-To-Spike profile is used increasingly. Shown
below in figure 5 and 6 are VISHAY's recommended
profiles for use with the TFDU4300 transceivers. For
more details please refer to the application note “SMD
Assembly Instructions”.
A ramp-up rate less than 0.9 °C/s is not
recommended. Ramp-up rates faster than 1.3 °C/s
could damage an optical part because the thermal
conductivity is less than compared to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be
recommended because the risk of damage is highly
dependent on the experience of the operator.
Nevertheless, we added a chapter to the above
mentioned application note, describing manual
soldering and desoldering.
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are
equivalent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
“Taping, Labeling, Storage and Packing”.
Figure 4. Recommended Solder Profile for Sn/Pb soldering
0
20
40
60
80
100
120
140
160
180
200
220
240
260
0 50 100 150 200 250 300 350
Time/s
Temperature (°C)
2 to 4 °C/s
2 to 4 °C/s
10 s max. at 230 °C
120 to180 s
160 °C max.
240 °C max.
90 s max.
19535
Figure 5. Solder Profile, RSS Recommendation
Figure 6. RTS Recommendation
0
25
50
75
100
125
150
175
200
225
250
275
0 50 100 150 200 250 300 350
Time/s
Temperature/°C
2 °C to 3 °C/s
2 °C to 4 °C/s
T
≥
255 °C for 10 s....30 s
19532
0
40
80
120
160
200
240
280
0 50 100 150 200 250 300
Time/s
Temperature/°C
< 4 °C/s
1.3 °C/s
Time above 217 °C t
≤
70 s
Time above 250 °C t
≤
40 s
Peak temperature T
peak
= 260 °C
< 2 °C/s
T
peak
= 260 °C max.
TFDU Fig3
