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CPC1777J

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
DS-CPC1777-R08 www.ixysic.com 1
e
3
Characteristics
Features
• 4.6A
DC
Load Current with 5°C/W Heat Sink
• Low 0.5On-Resistance
• 600V
P
Blocking Voltage
• 2500V
rms
Input/Output Isolation
• Low Thermal Resistance:
JC
= 0.35 °C/W
• Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Utility Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Certified Component: File E69938
Pin Configuration
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability
and compact size to a new family of High Power Solid
State Relays. As part of this new family, the CPC1777
single-pole normally open (1-Form-A) DC Solid State
Relay employs optically coupled MOSFET technology
to provide 2500V
rms
of input to output isolation.
The optically coupled outputs, that use patented
OptoMOS architecture, are controlled by a highly
efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance DC switching applications.
The unique i4-PAC package pioneered by IXYS
enables solid state relays to achieve the highest load
current and power ratings. This package features an
IXYS unique process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the usual copper leadframe. The
DCB ceramic, the same substrate used in high power
modules, not only provides 2500V
rms
isolation but also
very low junction-to-case thermal resistance
(0.35°C/W).
Ordering Information
Switching Characteristics
Parameter Rating Units
Blocking Voltage 600
V
P
Load Current, T
A
=25°C:
With 5°C/W Heat Sink 4.6
A
DC
No Heat Sink 1.5
On-Resistance (max) 0.5
Thermal Resistance,
Junction-to-Case,
JC
0.35 °C/W
12 34
+- -+
Part Description
CPC1777J i4-PAC Package (25 per tube)
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
CPC1777
600V Single-Pole, Normally Open
DC-Only Power Relay
I
NTEGRATED
C
IRCUITS
D
IVISION
R08 www.ixysic.com 2
CPC1777
1 Specifications
1.1 Absolute Maximum Ratings @ 25°C
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
1.2 Electrical Characteristics @ 25°C
1
Higher load currents possible with proper heat sinking.
2
Measurement taken within 1 second of on-time.
3
For applications requiring high temperature operation (T
C
> 60ºC) an LED drive current of 20mA is recommended.
Symbol Ratings Units
Blocking Voltage 600
V
P
Reverse Input Voltage 5
V
Input Control Current 50
mA
Peak (10ms) 1
A
Input Power Dissipation 150
mW
Isolation Voltage, Input to Output 2500 V
rms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125
°C
Parameter Conditions Symbol Minimum Typical Maximum Units
Output Characteristics
Load Current
1
Peak t10ms
I
L
--
20
A
P
Continuous No Heat Sink
1.5
Continuous
T
C
=25°C
15
A
DC
Continuous
T
C
=99°C
I
L(99)
2
On-Resistance
2
I
F
=10mA, I
L
=1A
R
ON
-0.350.5
Off-State Leakage Current
V
L
=600V
P
I
LEAK
--1A
Switching Speeds
Tu r n - O n
I
F
=20mA, V
L
=10V
t
on
-820
ms
Tu r n - O f f t
off
-0.155
Output Capacitance
V
L
=25V, f=1MHz
C
out
- 3500 - pF
Input Characteristics
Input Control Current to Activate
3
I
L
=1A
I
F
--10mA
Input Dropout Current to Deactivate - I
F
0.6 - - mA
Input Voltage Drop
I
F
=5mA
V
F
0.9 1.2 1.4 V
Reverse Input Current
V
R
=5V
I
R
--10A
Input/Output Characteristics
Capacitance, Input-to-Output -
C
I/O
-1-pF
I
NTEGRATED
C
IRCUITS
D
IVISION
3 www.ixysic.com R08
CPC1777
2 Thermal Characteristics
2.1 Thermal Management
Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal interface
material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate junction-to-ambient
thermal resistance of 12.5°C/W.
2.2 Heat Sink Calculation
Higher load currents are possible by using lower thermal resistance heat sink combinations.
Parameter Conditions Symbol Rating Units
Thermal Resistance (Junction to Case) -
JC
0.35 °C/W
Thermal Resistance (Junction to Ambient) Free Air
JA
40 °C/W
Junction Temperature (Operating) -
T
J
-40 to +100 °C
θ
CA
=
- θ
JC
(T
J
- T
A
) I
L(99)
2
I
L
2
• P
D(99)
T
J
= Junction Temperature (°C), T
J
≤ 100°C *
T
A
= Ambient Temperature (°C)
I
L(99)
= Load Current with Case Temperature @ 99°C (A
DC
)
I
L
= Desired Operating Load Current (A
DC
), I
L
≤ I
L(MAX)
θ
JC
= Thermal Resistance, Junction to Case (°C/W) = 0.35°C/W
θ
CA
= Thermal Resistance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
P
D(99)
= Maximum power dissipation with case temperature held at 99ºC = 2.86W
* Elevated junction temperature reduces semiconductor lifetime.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
Heat Sink Rating
P1-P3P4-P6P7-P7

CPC1777J

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Solid State Relays - PCB Mount DC Only Single Pole i4-PAC
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