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CPC1777J

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
R08 www.ixysic.com 4
CPC1777
3 Performance Data @25°C (Unless Otherwise Noted)
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
35
30
25
20
15
10
5
0
1.30 1.31 1.32 1.33 1.34
Typical LED Forward Voltage Drop
(N=50, I
F
=10mA, I
L
=1A
DC
)
LED Forward Voltage (V)
Device Count (N)
7.0 8.0 9.06.5 7.5 8.5
25
20
15
10
5
0
Turn-On (ms)
Device Count (N)
Typical Turn-On Time
(N=50, I
F
=10mA, I
L
=1A
DC
)
35
30
25
20
15
10
5
0
0.32 0.34 0.36 0.400.38 0.42
On-Resistance (Ω)
Device Count (N)
Typical On-Resistance Distribution
(N=50, I
F
=10mA, I
L
=1A
DC
)
35
30
25
20
15
10
5
0
815 820 825 830 835 840
Typical Blocking Voltage Distribution
(N=50)
Blocking Voltage (V
P
)
Device Count (N)
Typical LED Forward Voltage Drop
vs. Temperature
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
Temperature (ºC)
LED Forward Voltage Drop (V)
I
F
=50mA
I
F
=20mA
I
F
=10mA
0
5 1015202530354045
18
16
14
12
10
8
6
4
2
0
50
LED Forward Current (mA)
Turn-On (ms)
Typical Turn-On Time
vs. LED Forward Current
(I
L
=1A
DC
)
0
5 1015202530354045
0.17
0.16
0.15
0.14
0.13
0.12
0.11
0.10
0.09
0.08
50
LED Forward Current (mA)
Turn-Off (ms)
Typical Turn-Off Time
vs. LED Forward Current
(I
L
=1A
DC
)
LED Current (mA)
-40
20
18
16
14
12
10
8
6
4
2
0
-20 0 20 40 60 80 100
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=1A
DC
)
Temperature (ºC)
-40
14
12
10
8
6
4
2
0
-20 0 20 40 60 80 100
Turn-On (ms)
Typical Turn-On Time vs. Temperature
(I
F
=10mA, I
L
=1A
DC
)
Temperature (ºC)
-40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0
-20 0 20 40 60 80 100
Temperature (ºC)
Turn-Off (ms)
Typical Turn-Off Time vs. Temperature
(I
F
=10mA, I
L
=1A
DC
)
I
NTEGRATED
C
IRCUITS
D
IVISION
5 www.ixysic.com R08
CPC1777
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
-1.05 -0.70 -0.35
2.5
2.0
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
-2.0
-2.5
0.35 0.70
0
1.05
Load Voltage (V)
Load Current (A)
Typical Load Current
vs. Load Voltage
(I
F
=10mA)
Temperature (ºC)
020406080 100
Load Current (A
DC
)
0
2
4
6
8
10
12
Maximum Load Current
vs. Temperature with Heat Sink
(I
F
=20mA)
1ºC/W
5ºC/W
10ºC/W
Free Air
-40
845
840
835
830
825
820
815
810
805
-20 0 20 40 60 80 100
Blocking Voltage (V
P
)
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-40
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Temperature (ºC)
Leakage (μA)
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(V
L
=600V
P
)
Load Current (A)
24
20
16
12
8
4
0
1ms
10µs 100µs
100ms 10s10ms 1s 100s
Energy Rating Curve
Free Air, No Heat Sink
Time
-40
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
-20 0 20 40 60 80 100
On-Resistance (Ω)
Temperature (ºC)
Typical On-Resistance
vs. Temperature
(I
L
=Max Rated)
I
NTEGRATED
C
IRCUITS
D
IVISION
R08 www.ixysic.com 6
CPC1777
4 Manufacturing Information
4.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee
proper operation of our devices when handled according to the limitations and information in that standard as well as
to any limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
4.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
4.3 Soldering Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
4.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake may be necessary if a wash
is used after solder reflow processes. Chlorine-based or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Device Moisture Sensitivity Level (MSL) Rating
CPC1777J MSL 1
Device Maximum Temperature x Time
CPC1777J 245°C for 30 seconds
e
3
P1-P3P4-P6P7-P7

CPC1777J

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Solid State Relays - PCB Mount DC Only Single Pole i4-PAC
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