MRF6S19140HSR3

MRF6S19140HR3 MRF6S19140HSR3
1
RF Device Data
Freescale Semiconductor
RF Power Field Effect Transistors
N-Channel Enhancement - Mode Lateral MOSFETs
Designed for PCN and PCS base station applications with frequencies from
1930 to 1990 MHz. Suitable for TDMA, CDMA and multicarrier amplifier
applications. To be used in Class AB for PCN-PCS/cellular radio and WLL
applications.
Typical 2-Carrier N - CDMA Performance: V
DD
= 28 Volts, I
DQ
= 1150 mA,
P
out
= 29 Watts Avg., Full Frequency Band, IS-95 CDMA (Pilot, Sync,
Paging, Traffic Codes 8 Through 13) Channel Bandwidth = 1.2288 MHz,
PAR = 9.8 dB @ 0.01% Probability on CCDF.
Power Gain — 16 dB
Drain Efficiency — 27.5%
IM3 @ 2.5 MHz Offset — -37 dBc in 1.2288 MHz Channel Bandwidth
ACPR @ 885 kHz Offset — -51 dBc in 30 kHz Channel Bandwidth
Capable of Handling 10:1 VSWR, @ 28 Vdc, 1960 MHz, 140 Watts CW
Output Power
Features
Characterized with Series Equivalent Large- Signal Impedance Parameters
Internally Matched for Ease of Use
Qualified Up to a Maximum of 32 V
DD
Operation
Integrated ESD Protection
Optimized for Doherty Applications
RoHS Compliant
In Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 inch Reel.
Table 1. Maximum Ratings
Rating Symbol Value Unit
Drain- Source Voltage V
DSS
-0.5, +68 Vdc
Gate- Source Voltage V
GS
-0.5, +12 Vdc
Storage Temperature Range T
stg
- 65 to +150 °C
Case Operating Temperature T
C
150 °C
Operating Junction Temperature
(1,2)
T
J
225 °C
Table 2. Thermal Characteristics
Characteristic Symbol Value
(2,3)
Unit
Thermal Resistance, Junction to Case
Case Temperature 80°C, 140 W CW
Case Temperature 77°C, 29 W CW
R
θ
JC
0.33
0.38
°C/W
1. Continuous use at maximum temperature will affect MTTF.
2. MTTF calculator available at http://www.freescale.com/rf. Select Tools/Software/Application Software/Calculators to access
the MTTF calculators by product.
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes - AN1955.
Document Number: MRF6S19140H
Rev. 5, 5/2007
Freescale Semiconductor
Technical Data
MRF6S19140HR3
MRF6S19140HSR3
1930 - 1990 MHz, 29 W AVG., 28 V
2 x N-CDMA
LATERAL N -CHANNEL
RF POWER MOSFETs
CASE 465C-02, STYLE 1
NI- 880S
MRF6S19140HSR3
CASE 465B-03, STYLE 1
NI- 880
MRF6S19140HR3
Freescale Semiconductor, Inc., 2004- 2007. All rights reserved.
2
RF Device Data
Freescale Semiconductor
MRF6S19140HR3 MRF6S19140HSR3
Table 3. ESD Protection Characteristics
Test Methodology Class
Human Body Model (per JESD22- A114) 2 (Minimum)
Machine Model (per EIA/JESD22- A115) A (Minimum)
Charge Device Model (per JESD22- C101) IV (Minimum)
Table 4. Electrical Characteristics (T
C
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
Off Characteristics
Zero Gate Voltage Drain Leakage Current
(V
DS
= 68 Vdc, V
GS
= 0 Vdc)
I
DSS
10 µAdc
Zero Gate Voltage Drain Leakage Current
(V
DS
= 28 Vdc, V
GS
= 0 Vdc)
I
DSS
1 µAdc
Gate- Source Leakage Current
(V
GS
= 5 Vdc, V
DS
= 0 Vdc)
I
GSS
1 µAdc
On Characteristics
Gate Threshold Voltage
(V
DS
= 10 Vdc, I
D
= 300 µAdc)
V
GS(th)
1 2 3 Vdc
Gate Quiescent Voltage
(V
DD
= 28 Vdc, I
D
= 1150 mAdc, Measured in Functional Test)
V
GS(Q)
2 2.8 4 Vdc
Drain- Source On- Voltage
(V
GS
= 10 Vdc, I
D
= 3 Adc)
V
DS(on)
0.1 0.21 0.3 Vdc
Dynamic Characteristics
(1)
Reverse Transfer Capacitance
(V
DS
= 28 Vdc ± 30 mV(rms)ac @ 1 MHz, V
GS
= 0 Vdc)
C
rss
2 pF
Functional Tests (In Freescale Test Fixture, 50 ohm system) V
DD
= 28 Vdc, I
DQ
= 1150 mA, P
out
= 29 W Avg., f1 = 1930 MHz,
f2 = 1932.5 MHz and f1 = 1987.5 MHz, f2 = 1990 MHz, 2- carrier N- CDMA, 1.2288 MHz Channel Bandwidth Carriers. ACPR measured in
30 kHz Channel Bandwidth @ ±885 kHz Offset. IM3 measured in 1.2288 MHz Channel Bandwidth @ ±2.5 MHz Offset. PAR = 9.8 dB @
0.01% Probability on CCDF.
Power Gain G
ps
15 16 18 dB
Drain Efficiency η
D
26 27.5 %
Intermodulation Distortion IM3 -37 -35 dBc
Adjacent Channel Power Ratio ACPR -51 -48 dBc
Input Return Loss IRL -15 -9 dB
1. Part is internally matched both on input and output.
MRF6S19140HR3 MRF6S19140HSR3
3
RF Device Data
Freescale Semiconductor
Figure 1. MRF6S19140HR3(HSR3) Test Circuit Schematic
Z7 0.115 x 0.569 Microstrip
Z8 0.191 x 0.289 Microstrip
Z9 0.681 x 0.081 Microstrip
Z10 1.140 x 0.081 Microstrip
PCB Arlon GX0300- 55-22, 0.030, ε
r
= 2.5
Z1 0.864 x 0.082 Microstrip
Z2 1.373 x 0.082 Microstrip
Z3 0.282 x 0.900 Microstrip
Z4 0.103 x 0.900 Microstrip
Z5 0.094 x 1.055 Microstrip
Z6 0.399 x 1.055 Microstrip
RF
INPUT
RF
OUTPUT
C7
DUT
Z1
C1
R3
R1
V
BIAS
R5
B1
C13
+
C3
Z2 Z3
V
BIAS
C8
R4
R2
R6
B2
C14
+
C4
Z4
Z5 Z6 Z7
C5 C9 C11
C15
+
V
SUPPLY
Z8 Z9
C2
Z10
V
SUPPLY
C6 C10 C12
Table 5. MRF6S19140HR3(HSR3) Test Circuit Component Designations and Values
Part Description Part Number Manufacturer
B1, B2 Beads, Surface Mount 2743019447 Fair- Rite
C1, C2 39 pF Chip Capacitors ATC100B390JT500XT ATC
C3, C4, C5, C6 9.1 pF Chip Capacitors ATC100B9R1CT500XT ATC
C7, C8, C9, C10, C11, C12 10 µF, 50 V Chip Capacitors GRM55DR61H106KA88B Murata
C13, C14 47 µF, 50 V Electrolytic Capacitors EMVY500ADA470MF80G Nippon
C15 470 µF, 63 V Electrolytic Capacitor ESMG630ELL471MK205 United Chemi- Con
R1, R2 560 k, 1/4 W Chip Resistors CRCW12065600FKTA Vishay
R3, R4 1.0 k, 1/4 W Chip Resistors CRCW12061001FKTA Vishay
R5, R6 12 , 1/4 W Chip Resistors CRCW120612R0FKTA Vishay

MRF6S19140HSR3

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
RF MOSFET Transistors HV6 28V29W LDMOS NI880HS
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet