IRFB20N50KPBF

Document Number: 91101 www.vishay.com
S09-2236-Rev. D, 05-Apr-10 1
Power MOSFET
IRFB20N50K, SiHFB20N50K
Vishay Siliconix
FEATURES
Low Gate Charge Q
g
Results in Simple Drive
Requirement
Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness
Fully Characterized Capacitance and Avalanche Voltage
and Current
•Low R
DS(on)
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Switch Mode Power Supply (SMPS)
Uninterruptible Power Supply
High Speed Power Switching
Hard Switched and High Frequency Circuits
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature.
b. Starting T
J
= 25 °C, L = 1.6 mH, R
g
= 25 Ω, I
AS
= 20 A.
c. I
SD
20 A, dI/dt 350 A/µs, V
DD
V
DS
, T
J
150 °C.
d. 1.6 mm from case.
PRODUCT SUMMARY
V
DS
(V) 500
R
DS(on)
(Ω)V
GS
= 10 V 0.21
Q
g
(Max.) (nC) 110
Q
gs
(nC) 33
Q
gd
(nC) 54
Configuration Single
N-Channel MOSFET
G
D
S
TO-220
G
D
S
Available
RoHS*
COMPLIANT
ORDERING INFORMATION
Package TO-220
Lead (Pb)-free
IRFB20N50KPbF
SiHFB20N50K-E3
SnPb
IRFB20N50K
SiHFB20N50K
ABSOLUTE MAXIMUM RATINGS T
C
= 25 °C, unless otherwise noted
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
500
V
Gate-Source Voltage V
GS
± 30
Continuous Drain Current V
GS
at 10 V
T
C
= 25 °C
I
D
20
AT
C
= 100 °C 12
Pulsed Drain Current
a
I
DM
80
Linear Derating Factor 2.2 W/°C
Single Pulse Avalanche Energy
b
E
AS
330 mJ
Repetitive Avalanche Current
a
I
AR
20 A
Repetitive Avalanche Energy
a
E
AR
28 mJ
Maximum Power Dissipation T
C
= 25 °C P
D
280 W
Peak Diode Recovery dV/dt
c
dV/dt 10 V/ns
Operating Junction and Storage Temperature Range T
J
, T
stg
- 55 to + 150
°C
Soldering Recommendations (Peak Temperature) for 10 s 300
d
Mounting Torque 6-32 or M3 screw 10 N
* Pb containing terminations are not RoHS compliant, exemptions may apply
www.vishay.com Document Number: 91101
2 S09-2236-Rev. D, 05-Apr-10
IRFB20N50K, SiHFB20N50K
Vishay Siliconix
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature.
b. Pulse width 400 µs; duty cycle 2 %.
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYP. MAX. UNIT
Maximum Junction-to-Ambient R
thJA
-58
°C/WCase-to-Sink, Flat, Greased Surface R
thCS
0.50 -
Maximum Junction-to-Case (Drain) R
thJC
-0.45
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 µA 500 - - V
V
DS
Temperature Coefficient ΔV
DS
/T
J
Reference to 25 °C, I
D
= 1 mA - 0.61 - V/°C
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA 3.0 - 5.0 V
Gate-Source Leakage I
GSS
V
GS
= ± 30 V - - ± 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 500 V, V
GS
= 0 V - - 50
µA
V
DS
= 400 V, V
GS
= 0 V, T
J
= 125 °C - - 250
Drain-Source On-State Resistance R
DS(on)
V
GS
= 10 V I
D
= 12 A
b
- 0.21 0.25 Ω
Forward Transconductance g
fs
V
DS
= 50 V, I
D
= 12 A 11 - - S
Dynamic
Input Capacitance C
iss
V
GS
= 0 V,
V
DS
= 25 V,
f = 1.0 MHz, see fig. 5
- 2870 -
pF
Output Capacitance C
oss
- 320 -
Reverse Transfer Capacitance C
rss
-34-
Output Capacitance C
oss
V
GS
= 0 V
V
DS
= 1.0 V, f = 1.0 MHz - 3480 -
V
DS
= 400 V, f = 1.0 MHz - 85 -
Effective Output Capacitance C
oss
eff. V
DS
= 0 V to 400 V - 160 -
Total Gate Charge Q
g
V
GS
= 10 V
I
D
= 20 A, V
DS
= 400 V
see fig. 6 and 13
b
- - 110
nC Gate-Source Charge Q
gs
--33
Gate-Drain Charge Q
gd
--54
Turn-On Delay Time t
d(on)
V
DD
= 250 V, I
D
= 20 A
R
g
= 7.5 Ω, V
GS
= 10 V, see fig. 10
b
-22-
ns
Rise Time t
r
-74-
Turn-Off Delay Time t
d(off)
-45-
Fall Time t
f
-33-
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
MOSFET symbol
showing the
integral reverse
p - n junction diode
--20
A
Pulsed Diode Forward Current
a
I
SM
--80
Body Diode Voltage V
SD
T
J
= 25 °C, I
S
= 20 A, V
GS
= 0 V
b
--1.5V
Body Diode Reverse Recovery Time t
rr
T
J
= 25 °C, I
F
= 20 A, dI/dt = 100 A/µs
b
- 520 780 ns
Body Diode Reverse Recovery Charge Q
rr
-5.38.0µC
Forward Turn-On Time t
on
Intrinsic turn-on time is negligible (turn-on is dominated by L
S
and L
D
)
S
D
G
Document Number: 91101 www.vishay.com
S09-2236-Rev. D, 05-Apr-10 3
IRFB20N50K, SiHFB20N50K
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Fig. 1 - Typical Output Characteristics
Fig. 2 - Typical Output Characteristics
Fig. 3 - Typical Transfer Characteristics
Fig. 4 - Normalized On-Resistance vs. Temperature
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
0.01
0.1
1
10
100
I
D
,
Drain-to-Source Cur
rent (A)
5.0V
20 µs Pulse Width
T
J
= 25 °C
VGS
15 V
12 V
10 V
8.0 V
7.0 V
6.0 V
5.5 V
Bottom 5.0 V
Top
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
0.01
0.1
1
10
100
I
D
,
Drain-to-Source Cur
rent (A)
VGS
15 V
12 V
10 V
8.0 V
7.0 V
6.0 V
5.5 V
Bottom 5.0 V
Top
5.0V
20 µs Pulse Width
T
J
= 25 °C
5.0 6.0 7.0 8.0 9.0 10.0
V ,
GS
Gate-to-Source Voltage (V)
0.0
0.1
1.0
10.0
100.0
T
J
= 25 °C
V
DS
= 50 V
20 ms Pulse width
I
D
,
Drain-to-Source Current (A)
T
J
= 150 °C
- 60 - 40 - 20 0 20 40 60 80 100 120 140 160
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
r
DS(on)
, Drain-to-Source On-Resistance
(normalised)
T
J
, Junction Temperature (°C)
V
I =
GS
D
20 A
= 10 V

IRFB20N50KPBF

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET RECOMMENDED ALT 844-IRFB20N50K
Lifecycle:
New from this manufacturer.
Delivery:
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