
HMC344ATCPZ-EP Enhanced Product
Rev. 0 | Page 8 of 8
OUTLINE DIMENSIONS
3.10
3.00 SQ
2.90
0.30
0.25
0.20
1.80
1.70 SQ
1.60
1
0.50
BSC
BOTTOM VIEWTOP VIEW
SIDE VIEW
16
5
8
9
12
13
4
0.05 MAX
0.02 NOM
0.203 REF
0.20 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.90
0.85
0.80
0.45
0.40
0.35
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
02-23-2017-A
PKG-005376
COMPLIANT TO JEDEC STANDARDS MO-220-VEED-4
EXPOSED
PAD
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
SEATING
PLANE
F
igure 10. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.85 mm Package Height
(CP-16-51)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
HMC344ATCPZ-EP-PT −55°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-51
HMC344ATCPZ-EP-R7 −55°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-51
1
All models are RoHS compliant parts.
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D16637-0-3/18(0)