Philips Semiconductors
BSH108
N-channel enhancement mode field-effect transistor
Product specification Rev. 02 — 25 October 2000 3 of 13
9397 750 07652
© Philips Electronics N.V. 2000. All rights reserved.
V
GS
5V
Fig 1. Normalized total power dissipation as a
function of solder point temperature.
Fig 2. Normalized continuous drain current as a
function of solder point temperature.
T
sp
=25°C; I
DM
is single pulse.
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage.
03aa17
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175
P
der
T
sp
(
o
C)
(%)
03aa25
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175
I
der
T
sp
(
o
C)
(%)
P
der
P
tot
P
tot 25 C
°
()
----------------------
100%×=
I
der
I
D
I
D25C
°
()
-------------------
100%×=
03aa80
I
D
(A)
µ
µ
t
p
t
p
T
P
t
T
δ
=
Philips Semiconductors
BSH108
N-channel enhancement mode field-effect transistor
Product specification Rev. 02 — 25 October 2000 4 of 13
9397 750 07652
© Philips Electronics N.V. 2000. All rights reserved.
7. Thermal characteristics
7.1 Transient thermal impedance
Table 4: Thermal characteristics
Symbol Parameter Conditions Value Unit
R
th(j-sp)
thermal resistance from junction to solder point mounted on a metal clad substrate; Figure 4 150 K/W
R
th(j-a)
thermal resistance from junction to ambient mounted on a printed circuit board;
minimum footprint
350 K/W
Mounted on a metal clad substrate.
Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration.
03aa79
Z
th(j-sp)
(K/W)
δ
t
p
t
p
T
P
t
T
δ =
Philips Semiconductors
BSH108
N-channel enhancement mode field-effect transistor
Product specification Rev. 02 — 25 October 2000 5 of 13
9397 750 07652
© Philips Electronics N.V. 2000. All rights reserved.
8. Characteristics
Table 5: Characteristics
T
j
=25
°
C unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source breakdown voltage I
D
=10µA; V
GS
=0V
T
j
=25°C3040 V
T
j
= 55 °C27−−V
V
GS(th)
gate-source threshold voltage I
D
= 1 mA; V
DS
=V
GS
; Figure 9
T
j
=25°C 1 1.5 2 V
T
j
= 150 °C 0.5 −−V
T
j
= 55 °C −−3.2 V
I
DSS
drain-source leakage current V
DS
=24V; V
GS
=0V
T
j
=25°C 0.01 1.0 µA
T
j
= 150 °C −−10 µA
I
GSS
gate-source leakage current V
GS
= ±10 V; V
DS
=0V 10 100 nA
R
DSon
drain-source on-state resistance V
GS
= 10 V; I
D
=1A;Figure 7 and 8
T
j
=25°C 77 120 m
V
GS
=5V; I
D
=1A;Figure 7 and 8
T
j
=25°C 102 140 m
T
j
= 150 °C 170 240 m
Dynamic characteristics
g
fs
forward transconductance V
DS
=10V; I
D
=1A;Figure 11 2 4.5 S
Q
g(tot)
total gate charge V
DD
=15V; V
GS
=10V; I
D
=5A;Figure 14 6.4 10 nC
Q
gs
gate-source charge 0.5 nC
Q
gd
gate-drain (Miller) charge 1.3 nC
C
iss
input capacitance V
GS
=0V; V
DS
= 10 V; f = 1 MHz; Figure 12 190 pF
C
oss
output capacitance 70 pF
C
rss
reverse transfer capacitance 50 pF
t
d(on)
turn-on delay time V
DD
=10V; R
L
=10; V
GS
=10V; R
G
=6Ω−3 ns
t
r
rise time 8 ns
t
d(off)
turn-off delay time 15 ns
t
f
fall time 26 ns
Source-drain diode
V
SD
source-drain (diode forward) voltage I
S
= 0.83 A; V
GS
=0V;Figure 13 0.8 1.2 V
t
rr
reverse recovery time I
S
= 1 A; dI
S
/dt = 100 A/µs; V
GS
=0V;
V
DS
=25V
25 ns
Q
r
recovered charge 20 nC

BSH108,215

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET TAPE7 PWR-MO
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet