September 2010 Doc ID 13251 Rev 3 1/8
8
EMIF03-SIM02C2
3-line IPAD™ EMI filter including ESD protection
Features
■ EMI symmetrical (I/O) low-pass filter
■ high efficiency in EMI filtering
■ lead-free coated package
■ very low PCB space occupation:
– 1.42 mm x 1.42 mm
■ very thin package: 0.65 mm
■ high efficiency in ESD suppression
■ high reliability offered by monolithic integration
■ high reduction of parasitic elements through
integration and wafer level packaging
Complies with following standards:
■ IEC 61000-4-2 level 4 on external and V
CC
pins:
– 15 kV (air discharge)
– 8 kV (contact discharge)
■ MIL STD 883G - Method 3015-7 Class 3
Applications
Where EMI filtering in ESD sensitive equipment is
required:
■ SIM Interface (subscriber identify module)
■ UIM Interface (universal identify module)
Description
The EMIF03-SIM02C2 is a highly integrated
device designed to suppress EMI/RFI noise in all
systems subjected to electromagnetic
interference. The EMIF03 Flip-Chip packaging
means the package size is equal to the die size.
This filter includes an ESD protection circuitry
which protects the application from damage when
subjected to ESD surges up 15 kV.
TM: IPAD is a trademark of STMicroelectronics
Figure 1. Pin configuration (bump side)
Coated Flip-Chip package
(8 bumps)
B
C
123
A
RST
in
RST
ext
CLK
in
Data
in
Gnd
V
CC
CLK
ext
Data
ext
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