Package information EMIF03-SIM02C2
6/8 Doc ID 13251 Rev 3
3 Package information
● Epoxy meets UL94, V0
● Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Figure 14. Flip-Chip dimensions
Figure 15. Marking Figure 16. Footprint recommendation
1.42mm ± 50µm
1.42mm ± 50µm
315µm ± 50
500µm ± 50
500µm ± 50
695µm ± 65
x
y
x
w
z
w
Dot, ST logo
ECOPACK status
xx = marking
yww = datecode
(y = year
z = manufacturing location
Copper pad Diameter:
250 µm recommended, 300 µm max
Solder stencil opening: 330 µm
Solder mask opening recommendation:
340 µm min for 315 µm copper pad diameter
