STD2NK100Z - STP2NK100Z - STU2NK100Z Electrical ratings
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1 Electrical ratings
Table 2. Absolute maximum ratings
Symbol Parameter Value Unit
V
DS
Drain-source voltage (V
GS
= 0)
1000 V
V
GS
Gate-source voltage ± 30 V
I
D
Drain current (continuous) at T
C
= 25 °C
1.85 A
I
D
Drain current (continuous) at T
C
= 100 °C
1.16 A
I
DM
(1)
1. Pulse width limited by safe operating area
Drain current (pulsed) 7.4 A
P
TOT
Total dissipation at T
C
= 25 °C
70 W
Derating factor 0.56 W/°C
V
ESD(G-S)
G-S ESD (HBM C=100 pF, R=1.5 kΩ) 3000 V
dv/dt
(2)
2. I
SD
≤ 1.85 A, di/dt ≤ 200 A/µs, V
DD
= 80% V
(BR)DSS
Peak diode recovery voltage slope 2.5 V/ns
T
j
T
stg
Operating junction temperature
Storage temperature
-55 to 150 °C
Table 3. Thermal data
Symbol Parameter
Value
Unit
TO-220 IPAK DPAK
R
thj-case
Thermal resistance junction-case max 1.79 °C/W
R
thj-pcb
Thermal resistance junction-pcb minimum footprint -- -- 50 °C/W
R
thj-amb
Thermal resistance junction-amb max 62.5 100 °C/W
T
l
Maximum lead temperature for soldering purpose 300 °C
Table 4. Avalanche data
Symbol Parameter Value Unit
I
AR
(1)
1. Pulse width limited by Tjmax
Avalanche current, repetitive or not-repetitive 1.85 A
E
AS
(2)
2. Starting Tj = 25°C, I
D
= I
AR
, V
DD
= 50V
Single pulse avalanche energy 170 mJ
