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LT3570EUF#TRPBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
LT3570
19
3570fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
UF Package
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697)
PACKAGE DESCRIPTION
FE Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation CB
4.00 ± 0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
2423
1
2
BOTTOM VIEW—EXPOSED PAD
2.45 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UF24) QFN 0105
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.70 ±0.05
0.25 ±0.05
0.50 BSC
2.45 ± 0.05
(4 SIDES)
3.10 ± 0.05
4.50 ± 0.05
PACKAGE
OUTLINE
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 × 45° CHAMFER
FE20 (CB) TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0° – 8°
0.25
REF
RECOMMENDED SOLDER PAD LAYOUT
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
134
5
6
7
8910
111214 13
6.40 – 6.60*
(.252 – .260)
3.86
(.152)
2.74
(.108)
20 1918 17 16 15
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
2
2.74
(.108)
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
3.86
(.152)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
LT3570
20
3570fb
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
FAX: (408) 434-0507
●
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2008
LT 0309 REV B • PRINTED IN USA
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ThinSOT is a trademark of Linear Technology Corporation.
V
IN1
SHDN1
SHDN2
SHDN3
SHDN1
SHDN2
SHDN3
SW1
FB1
C8
100nF
C7
1nF
C5
10nF
C2
22µF
C3
4.7µF
V
OUT3
1.8V
500mA
R3
34k
V
OUT2
3.3V
500mA
R8
25k
R1
191k
V
OUT1
15V
200mA
V
IN
4V TO 12V
R7
25k
R2
10.7k
R4
10.7k
R5
13.7k
R6
10.7k
3570 TA04
R9
20k
C9
10µF
C1
10µF
C6
1nF
C4
10nF
L2
8.2µH
L1
12µH
D2
D3
D1
BOOST
SW2
FB2
SS2
NPN_DRV
FB3
V
C2
SS1
V
C1
V
IN2
V
IN3
BIAS
R
T
SYNC
LT3570
GND
Q1
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20

LT3570EUF#TRPBF

Mfr. #:
Buy LT3570EUF#TRPBF
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 1.5A Buck Conv, 1.5A Boost Conv & LDO Cn
Lifecycle:
New from this manufacturer.
Delivery:
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