NUP2201MR6, SZNUP2201MR6
www.onsemi.com
8
PACKAGE DIMENSIONS
TSOP−6
CASE 318G−02
ISSUE V
23
456
D
1
e
b
E
A1
A
0.05 (0.002)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
c
L
0.95
0.037
1.9
0.075
0.95
0.037
ǒ
mm
inches
Ǔ
SCALE 10:1
1.0
0.039
2.4
0.094
0.7
0.028
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
H
E
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.90 1.00 1.10 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b 0.25 0.38 0.50 0.010
c 0.10 0.18 0.26 0.004
D 2.90 3.00 3.10 0.114
E 1.30 1.50 1.70 0.051
e 0.85 0.95 1.05 0.034
L 0.20 0.40 0.60 0.008
0.039 0.043
0.002 0.004
0.014 0.020
0.007 0.010
0.118 0.122
0.059 0.067
0.037 0.041
0.016 0.024
NOM MAX
2.50 2.75 3.00 0.099 0.108 0.118
H
E
− −
0° 10° 0° 10°
q
q
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