DMOS Dual Full-Bridge PWM Motor Driver
With Overcurrent Protection
A4987
15
Allegro MicroSystems, LLC
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
ES Package, 24-Pin QFN with Exposed Thermal Pad
0.95
C
SEATING
PLANE
C0.08
25X
24
24
2
1
1
2
24
2
1
A
A
Terminal #1 mark area
Coplanarity includes exposed thermal pad and terminals
B
Exposed thermal pad (reference only, terminal #1
identifier appearance at supplier discretion)
For Reference Only; not for tooling use (reference JEDEC MO-220WGGD)
Dimensions in millimeters
Exact case and lead configuration at supplier discretion within limits shown
C
D
D
C
Reference land pattern layout (reference IPC7351
QFN50P400X400X80-25W6M)
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances; when
mounting on a multilayer PCB, thermal vias at the exposed thermal pad land
can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5)
4.10
0.30
0.50
4.10
0.50 BSC
4.00 ±0.15
4.00 ±0.15
2.70
2.70
2.70
2.70
0.75 ±0.05
0.45 MAX
B
PCB Layout Reference View
0.25
+0.05
–0.07