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ADG1212YRUZ

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16
Data Sheet ADG1211/ADG1212/ADG1213
Rev. D | Page 13 of 16
IN
V
OUT
ADG1212
ADG1211
V
IN
V
IN
V
OUT
OFF
V
OUT
ON
Q
INJ
= C
L
V
OUT
SD
V
DD
V
SS
V
DD
V
SS
V
S
R
S
GND
C
L
1nF
04778-025
Figure 25. Charge Injection
V
OUT
50
NETWORK
ANALYZER
R
L
50
IN
V
IN
S
D
50
OFF ISOLATION = 20 LOG
V
OUT
V
S
V
S
V
DD
V
SS
0.1F
V
DD
0.1F
V
SS
GND
04778-026
Figure 26. Off Isolation
CHANNEL-TO-CHANNEL CROSSTALK = 20 LOG
V
OUT
GND
S1
D
S2
V
OUT
NETWORK
ANALYZER
R
L
50
R
50
V
S
V
S
V
DD
V
SS
0.1F
V
DD
0.1F
V
SS
04778-027
Figure 27. Channel-to-Channel Crosstalk
V
OUT
50
NETWORK
ANALYZER
R
L
50
IN
V
IN
S
D
INSERTION LOSS = 20 LOG
V
OUT
WITH SWITCH
V
OUT
WITHOUT SWITCH
V
S
V
DD
V
SS
0.1F
V
DD
0.1F
V
SS
GND
04778-028
Figure 28. Bandwidth
V
OUT
R
S
AUDIO PRECISION
R
L
10k
IN
V
IN
S
D
V
S
V p-p
V
DD
V
SS
0.1F
V
DD
0.1F
V
SS
GND
04778-032
Figure 29. THD + Noise
ADG1211/ADG1212/ADG1213 Data Sheet
Rev. D | Page 14 of 16
OUTLINE DIMENSIONS
16
9
81
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 30. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
1.45
1.30 SQ
1.15
111808-A
1
0.50
BSC
BOT
TOM VIEWTOP VIEW
16
5
8
9
12
13
4
EXPOSED
PAD
PIN 1
INDIC
AT
OR
3.10
3.00 SQ
2.90
0.50
0.40
0.30
SEA
TING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICA
TOR
0.30
0.23
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WEED.
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.80
0.75
0.70
Figure 31. 16-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-16-21)
Dimensions shown in millimeters
Data Sheet ADG1211/ADG1212/ADG1213
Rev. D | Page 15 of 16
ORDERING GUIDE
Model
1
Temperature Range
Package Description
Package Option
Branding
ADG1211YRUZ −40°C to +125°C Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1211YRUZ-REEL −40°C to +125°C Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1211YRUZ-REEL7 −40°C to +125°C Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1211YCPZ-500RL7 −40°C to +125°C Lead Frame Chip Scale Package [LFCSP] CP-16-21 S07
ADG1211YCPZ-REEL7 −40°C to +125°C Lead Frame Chip Scale Package [LFCSP] CP-16-21 S07
ADG1212YRUZ −40°C to +125°C Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1212YRUZ-REEL7 −40°C to +125°C Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1212YCPZ-500RL7 −40°C to +125°C Lead Frame Chip Scale Package [LFCSP] CP-16-21 S08
ADG1212YCPZ-REEL7 −40°C to +125°C Lead Frame Chip Scale Package [LFCSP] CP-16-21 S08
ADG1213YRUZ −40°C to +125°C Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1213YRUZ-REEL7 −40°C to +125°C Thin Shrink Small Outline Package [TSSOP] RU-16
ADG1213YCPZ-500RL7
−40°C to +125°C
Lead Frame Chip Scale Package [LFCSP]
CP-16-21
S09
ADG1213YCPZ-REEL7
−40°C to +125°C
Lead Frame Chip Scale Package [LFCSP]
CP-16-21
S09
1
Z = RoHS Compliant Part.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P16

ADG1212YRUZ

Mfr. #:
Buy ADG1212YRUZ
Manufacturer:
Analog Devices Inc.
Description:
Analog Switch ICs IC 120 Ohm 16.2V iCMOS Quad SPST
Lifecycle:
New from this manufacturer.
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