CBTL04DP211 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 2 — 13 April 2012 5 of 18
NXP Semiconductors
CBTL04DP211
DisplayPort 2 : 1 multiplexer
[1] HVQFN32 package die supply ground is connected to both GND pins and exposed center pad. GND pins
and the exposed center pad must be connected to supply ground for proper device operation. For
enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the
board using a corresponding thermal pad on the board and for proper heat conduction through the board,
thermal vias need to be incorporated in the printed-circuit board in the thermal pad region.
OUT_0+ 1 differential I/O Two bidirectional high-speed differential pairs for
DisplayPort Main Link signals.
OUT_0− 2 differential I/O
OUT_1+ 4 differential I/O
OUT_1− 5 differential I/O
AUX1+ 19 differential I/O High-speed differential pair for AUX signals,
path 1.
AUX1− 18 differential I/O
AUX2+ 15 differential I/O High-speed differential pair for AUX signals,
path 2.
AUX2− 14 differential I/O
AUX+ 6 differential I/O High-speed differential pair for AUX signals.
AUX− 7 differential I/O
HPD_1 17 single-ended I/O Single-ended channel for the HPD signal, path 1.
HPD_2 13 single-ended I/O Single-ended channel for the HPD signal, path 2.
HPD_IN 8 single-ended I/O Single-ended channel for the HPD signal.
V
DD
3, 9, 12, 16,
20, 29
power supply 3.3 V power supply.
GND
[1]
21, 28,
center pad
ground Ground.
n.c. 11 - Not connected. This pin is not connected to any
signal internally.
Table 2. Pin description
…continued
Symbol Pin Type Description
