Provides system software with an efficient means to move data and perform cache operations between two
disjoint address spaces
Eliminates the need to copy data from a source context into a kernel context, change to destination address
space, then copy the data to the destination address space or alternatively to map the user space into the
kernel address space
The arrangement of cores into clusters with shared L2 caches is part of a major re-architecture of the QorIQ cache hierarchy.
Details of the banked L2 are provided below.
2 MB cache with ECC protection (data, tag, & status)
64-byte cache line size
16 way, set associative
Ways in each bank can be configured in one of several modes
Flexible way partitioning per vCPU
I-only, D-only, or unified
Supports direct stashing of datapath architecture data into L2
4.5 Inverted cache hierarchy
From the perspective of software running on an core vCPU, the SoC incorporates a 2-level cache hierarchy. These levels are
as follows:
Level 1: Individual core 32 KB Instruction and Data caches
Level 2: Locally banked 2 MB cache (configurably shared by other vCPUs in the cluster)
Therefore, the CPC is not intended to act as backing store for the L2s. This allows the CPCs to be dedicated to the non-CPU
masters in the SoC, storing DPAA data structures and IO data that the CPUs and accelerators will most likely need.
Although the SoC supports allocation policies that would result in CPU instructions and in data being held in the CPC (CPC
acting as vCPU L3), this is not the default. Because the CPC serves fewer masters, it serves those masters better, by reducing
the DDR bandwidth consumed by the DPAA and improving the average latency.
4.6 CoreNet fabric and address map
As Freescale's next generation front-side interconnect standard for multicore products, the CoreNet fabric provides the
following:
A highly concurrent, fully cache coherent, multi-ported fabric
Point-to-point connectivity with flexible protocol architecture allows for pipelined interconnection between CPUs,
platform caches, memory controllers, and I/O and accelerators at up to 800 MHz
The CoreNet fabric has been designed to overcome bottlenecks associated with shared bus architectures, particularly
address issue and data bandwidth limitations. The chip's multiple, parallel address paths allow for high address
bandwidth, which is a key performance indicator for large coherent multicore processors.
Eliminates address retries, triggered by CPUs being unable to snoop within the narrow snooping window of a shared
bus. This results in the chip having lower average memory latency.
This chip's 40-bit, physical address map consists of local space and external address space. For the local address map, 32
local access windows (LAWs) define mapping within the local 40-bit (1 TB) address space. Inbound and outbound
translation windows can map the chip into a larger system address space such as the RapidIO or PCIe 64-bit address
environment. This functionality is included in the address translation and mapping units (ATMUs).
Chip features
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Freescale Semiconductor, Inc. 7
4.7 DDR memory controller
The chip offers a single DDR controller supporting ECC protected memories. This DDR controller operates at up to 2133
MHz for DDR3, and, in more power-sensitive applications, up to 1866.667 MHz for DDR3L. Some key DDR controller
features are as follows:
Support x8 and x16 memory widths
Programmable support for single-, dual-, and quad-ranked devices and modules
Support for both unbuffered and registered DIMMs
4 chip-selects
40-bit address support, up to 1 TB memory
The SoC can be configured to retain the currently active SDRAM page for pipelined burst accesses. Page mode support
of up to 64 simultaneously open pages can dramatically reduce access latencies for page hits. Depending on the
memory system design and timing parameters, page mode can save up to ten memory clock cycles for subsequent burst
accesses that hit in an active page.
Using ECC, the SoC detects and corrects all single-bit errors and detects all double-bit errors and all errors within a
nibble.
Upon detection of a loss of power signal from external logic, the DDR controller can put compliant DDR SDRAM
DIMMs into self-refresh mode, allowing systems to implement battery-backed main memory protection.
In addition, the DDR controller offers an initialization bypass feature for use by system designers to prevent re-
initialization of main memory during system power-on after an abnormal shutdown.
Support active zeroization of system memory upon detection of a user-defined security violation.
4.7.1 DDR bandwidth optimizations
Multicore SoCs are able to increase CPU and network interface bandwidths faster than commodity DRAM technologies are
improving. As a result, it becomes increasingly important to maximize utilization of main memory interfaces to avoid a
memory bottleneck. The SoC's DDR controller Freescale-developed IP, optimized for the QorIQ SoC architecture, with the
goal of improving DDR bandwidth utilization by fifty percent when compared to first generation QorIQ SoCs.
The WRITE and READ bandwidth improvement is achieved through target queue enhancements; specifically, changes to the
scheduling algorithm, improvements in the bank hashing scheme, support for more transaction re-ordering, and additional
proprietary techniques.
4.8 Universal serial bus (USB) 2.0
The two USB 2.0 controllers with integrated PHY provide point-to-point connectivity that complies with the USB
specification, Rev. 2.0. Each of the USB controllers with integrated PHY can be configured to operate as a stand-alone host,
and one of the controllers (USB #2) can be configured as a stand-alone device, or with both host and device functions
operating simultaneously.
Key features of the USB 2.0 controller include the following:
Complies with USB specification, Rev. 2.0
Supports high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) operations
Both controllers support operation as a stand-alone USB host controller
Supports USB root hub with one downstream-facing port
Enhanced host controller interface (EHCI)-compatible
Both controllers supports operation as a stand-alone USB device
Support one upstream-facing port
Support six programmable USB endpoints
The host and device functions are both configured to support all four USB transfer types:
Chip features
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8 Freescale Semiconductor, Inc.
Bulk
Control
Interrupt
Isochronous
4.9 High-speed peripheral interface complex (HSSI)
The SoC offers a variety of high-speed serial interfaces, sharing a set of 16 SerDes lanes. Each interface is backed by a high
speed serial interface controller. The SoC has the following types and quantities of controllers:
Four PCI Express controllers, one Gen 3.0 PCI Express controller with SRIOV, one Gen 3.0 PCI Express controller
without SRIOV and two PCI Express Gen 3.0 controllers
Two Serial RapidIO 2.0
Two SATA 2.0
Up to eight Ethernet controllers with various protocols
Aurora
The features of each high-speed serial controller are described in the subsequent sections. Debug functionality is described in
Debug support."
4.9.1 PCI Express
This chip instantiates four PCI Express controllers, each with the following key features:
One PCI Express controller supports end-point SR-IOV.
Two physical functions
64 virtual functions per physical function
Eight MSI-X per either physical function or virtual function
Two PCI Express controllers support 2.0 (maximum lane width off x8).
Two PCI Express controllers support 3.0 (maximum lane width of x4).
Power-on reset configuration options allow root complex or endpoint functionality.
x8, x4, x2, and x1 link widths support
Both 32- and 64-bit addressing and 256-byte maximum payload size
Inbound INTx transactions
Message signaled interrupt (MSI) transactions
4.9.2 Serial RapidIO
The Serial RapidIO interface is based on the RapidIO Interconnect Specification, Revision 2.1 . RapidIO is a high-
performance, point-to-point, low-pin-count, packet-switched system-level interconnect that can be used in a variety of
applications as an open standard. The rich feature set includes high data bandwidth, low-latency capability, and support for
high-performance I/O devices as well as message-passing and software-managed programming models. Receive and transmit
ports operate independently, and with 2 x 4 Serial RapidIO controllers, the aggregate theoretical bandwidth is 32 Gbps.
The chip offers two Serial RapidIO controllers Receive and transmit ports operate independently and with 2 x 4 Serial
RapidIO controllers; the aggregate theoretical bandwidth is 32 Gbps. The Serial RapidIO controllers can be used in
conjunction with "Rapid IO Message Manager (RMAN), as described in RapidIO Message Manager (RMan 1.0)."
Key features of the Serial RapidIO interface unit include the following:
Support for RapidIO Interconnect Specification, Revision 2.1 (All transaction flows and priorities.)
Chip features
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T2080NSE7PTB

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Microprocessors - MPU QorIQ, 64b Power Arch, 8x 1.5GHz threads, 1.87GT/s DDR3/3L, 4x10GE, crypto enabled, 0-105C, Rev 1.1
Lifecycle:
New from this manufacturer.
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