MAX9450/MAX9451/MAX9452
High-Precision Clock Generators
with Integrated VCXO
______________________________________________________________________________________ 13
AD0 AD1 ADDRESS
Low Low 1101000
Low Open 1101001
Low High 1101010
Open Low 1101011
Open Open 1101100
Open High 1101101
High Low 1101110
High Open 1101111
High High Convert to SPI
Table 3. I
2
C Address Setting by AD0 and AD1
REGISTER NAME REGISTER ADDRESS FUNCTION
CR0 00000000 P divider
CR1 00000001 M divider byte 1
CR2 00000010 M divider byte 2
CR3 00000011 N1 divider
CR4 00000100 N2 divider
CR5 00000101 Control
CR6 00000110 Control
CR7 00000111 Status
CR8 00001000 Reserved
Table 4. I
2
C and SPI Register Address*
CR0 DIVIDING RATE FOR P
0000-0000 1
0000-0001 2
——
1111-1110 255
1111-1111 256
Table 5. Dividing Rate Setting for P Divider
CR1 CR2[7:1]* DIVIDING VALUE OF M
0000-0000 0000-000 1
0000-0000 0000-001 2
——
1111-1111 0011-110 8191
1111-1111 0011-111 8192
1111-1111 1111-111 32,768
Table 6. Dividing Rate Setting for M Divider
*When the SPI port is activated, the first address bit on the left
is omitted and the remaining 7 bits are used. The LSB is the
first bit on the right.
*The last 5 LSBs of CR3[4:0] and CR4[4:0] are reserved.
*CR2[0], the last LSB, is reserved.
CR3*
DIVIDING
VALUE OF N0
CR4*
DIVIDING
VALUE OF N1
000XXXXX 1 000XXXXX 1
001XXXXX 2 001XXXXX 2
010XXXXX 3 010XXXXX 3
011XXXXX 4 011XXXXX 4
100XXXXX 5 100XXXXX 5
101XXXXX 6 101XXXXX 6
110XXXXX 8 110XXXXX 8
111XXXXX 16 111XXXXX 16
Table 7. Dividing Rate Setting for N0 and
N1 Divider
MAX9450/MAX9451/MAX9452
High-Precision Clock Generators
with Integrated VCXO
14 ______________________________________________________________________________________
REGISTER ACTION
DEFAULT
CR0 P = 1 00000000
CR1 M = 1 00000000
CR2 M = 1 00000000
CR3 N0 = 1 00000000
CR4 N1 = 1 00000000
CR5, CR6
1. Outputs enable
2. IN0 is the default input
3. Both inputs are enabled by
SEL0 and SEL1
4. Monitor is nonrevertive
5. Holdover is disabled
CR5: 01100000
CR6: 00000000
CR7 Status 00000000
CR8 Reserved 00000000
Table 10. Register Default Values at Power-Up
CR5, CR6 FUNCTION STATE
CR5[7] Output disable
0: Outputs are enabled
1: Outputs disabled to logic-low
CR5[6] CLK0 enabling
0: CLK0 is disabled to high impedance (overrides CR5[7] = 1 setting)
1: CLK0 is enabled
CR5[5] CLK1 enabling
0: CLK1 is disabled to high impedance (overrides CR5[7] = 1 setting)
1: CLK1 is enabled
CR5[4]
Default input
setting
0: IN0 is the default input
1: IN1 is the default input
CR5[3:2] Input enabling
00: The selection is controlled by SEL0, SEL1 (see Table 2)
01: Enable IN0, disable IN1
10: Enable IN1, disable IN0
11: Enable both IN0 and IN1
CR5[1] Revert function
0: The function is not activated
1: The function is activated
CR5[0] CLK monitor reset C LK m oni tor i s r eset i n r ever t m od e: IN T = 0 and C R7[ 7] = 0, and the P LL sw i tches to the d efaul t i np ut
CR6[7]
Holdover function
enabling
0: Holdover function is disabled
1: Holdover function is enabled
CR6[6] Forced holdover
0: Holdover is in normal mode
1: Holdover is forced to be activated
As the bit goes from 0 to 1, the current VCXO frequency is taken as the nominal value
CR6[5]
Acquiring nominal
VCXO frequency
As this bit is toggling from 0 to 1, the current VCXO frequency is taking as the nominal holdover
value
CR6[4] Master reset The bit acts at the same as the input MR; CR6[4] = 1, the chip is reset
CR6[3] REF This bit is always set to zero
CR6[2] ODIV select
CR6[2] = 0: DIV0 output drives CLK2
CR6[2] = 1: DIV1 output drives CLK2
CR6[1] Acquire select
CR6[1] = 0 PLL controls the Xtal frequency
CR6[1] = 1 Xtal frequency is controlled by the acquired value (acquired at rising edge of CR6[5])
CR6[0] Reserved
Table 8. Control Registers and Control Functions
CR7 FUNCTION STATE
CR7[6] Status of IN0
CR7[5] Status of IN1
0: Normal
1: Failure detected
CR7[4]
Input clock
selection indicator
0: IN0 is currently used
1: IN1 is currently used
CR7[3] LOCK indicator
1: PLL not locked
0: PLL locked
CR7[2] Holdover status
1: Device is in holdover state
0: Device is in normal state
CR7[1:0] Reserved
Table 9. Mapping for the Input Monitor Status
MAX9450/MAX9451/MAX9452
High-Precision Clock Generators
with Integrated VCXO
______________________________________________________________________________________ 15
Applications Information
Crystal Selection
The MAX9450/MAX9451/MAX9452 internal VCXO cir-
cuitry requires an external crystal. The frequency of the
crystal ranges from 15MHz to 160MHz, depending on
the application. It is important to use a quartz crystal
that prevents reduction of the frequency pulling range,
temperature stability, or excessive output phase jitter.
Choose an AT-cut crystal that oscillates at the required
frequency on its fundamental mode with a variation of
25ppm, including frequency accuracy and operating
temperature range. Select a crystal with a load capaci-
tance of 8pF and a motional capacitance of at least 7fF
to achieve the specified pulling range.
Crystals from manufacturers KDS (www.kdsj.co.jp) and
4Timing (www.4timing.com) are recommended.
LVDS Cables and Connectors
The interconnect for LVDS typically has a 100Ω differ-
ential impedance. Use cables and connectors that
have matched differential impedance to minimize
impedance discontinuities.
Twisted-pair and shielded twisted-pair cables offer
superior signal quality compared to ribbon cable and
tend to generate less EMI due to magnetic-field-cancel-
ing effects.
Power-Supply Bypassing
Bypass V
DDA
, V
DD
, and V
DDQ
to ground with high-fre-
quency, surface-mount ceramic 0.1µF and 0.01µF
capacitors. Place the capacitors as close as possible
to the device with the 0.01µF capacitor closest to the
device pins.
Board Layout
Circuit-board trace layout is very important to maintain
the signal integrity of high-speed differential signals.
Maintaining integrity is accomplished in part by reduc-
ing signal reflections and skew and increasing com-
mon-mode noise immunity.
Signal reflections are caused by discontinuities in the
50Ω (100Ω for LVDS outputs) characteristic impedance
of the traces. Avoid discontinuities by maintaining the
distance between differential traces, not using sharp
corners or vias. Ensure the two traces are parallel and
close to each other to increase common-mode noise
immunity and reduce EMI. Matching the electrical length
of the differential traces further reduces signal skew.
Output Termination
Terminate the MAX9450 outputs with 50Ω to V
CC
- 2V
or use an equivalent thevenin termination. When a sin-
gle-ended signal is taken from a differential output, ter-
minate both outputs.
The MAX9452 outputs are specified for a 100Ω load,
but can drive 90Ω to 132Ω to accommodate various
types of interconnects. The termination resistor at the
driven receiver should match the differential character-
istic impedance of the interconnect and be located
close to the receiver input. Use a ±1% surface-mount
termination resistor.
Chip Information
PROCESS: CMOS
RESISTOR (kΩ) CURRENT (µA)
12 200.5
20 121.88
50 49.41
100 24.86
150 16.61
200 12.48
Table 11. Resistor Value vs. Charge-Pump
Current

MAX9451EHJ-T

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
VCXO Oscillators
Lifecycle:
New from this manufacturer.
Delivery:
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