NCP605, NCP606
http://onsemi.com
13
PACKAGE DIMENSIONS
DFN6 3x3.3 MM, 0.95 PITCH
CASE 506AX−01
ISSUE O
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PIN 1
REFERENCE
A
B
C0.15
2X
2X
TOP VIEW
D
E
C0.15
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 mm
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
E2
BOTTOM VIEW
b
0.10
6X
L
13
0.05
C AB
C
D2
4X
e
L1
64
6X
6X
(A3)
C
C0.08
6X
C0.10
SIDE VIEW
A1
A
SEATING
PLANE
DIM MIN NOM MAX
MILLIMETERS
A 0.80 −−− 0.90
A1 0.00 −−− 0.05
A3 0.20 REF
b 0.30 −−− 0.40
D 3.00 BSC
D2 1.90 −−− 2.10
E 3.30 BSC
E2 1.10 −−− 1.30
e 0.95 BSC
K 0.20 −−− −−−
L 0.40 −−− 0.60
(NOTE 3)
K
L1 0.00 −−− 0.15
6X
0.83
2.15
1.35
1
0.50
0.95
PITCH
3.60
DIMENSIONS: MILLIMETERS
6X
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