BAS28 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 3 — 22 July 2010 3 of 12
NXP Semiconductors
BAS28
High-speed double diode
5. Limiting values
[1] Device mounted on an FR4 PCB.
[2] One diode loaded.
[3] T
j
=25°C prior to surge.
6. Thermal characteristics
[1] Device mounted on an FR4 PCB.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per diode
V
RRM
repetitive peak
reverse voltage
-85V
V
R
reverse voltage - 75 V
I
F
forward current
[1]
-215mA
I
FRM
repetitive peak
forward current
-500mA
I
FSM
non-repetitive peak
forward current
square wave
[3]
t
p
=1μs-4A
t
p
=1ms - 1 A
t
p
=1s - 0.5 A
Per device
P
tot
total power dissipation T
amb
=25°C
[1][2]
-250mW
T
j
junction temperature - 150 °C
T
stg
storage temperature −65 +150 °C
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per device; one diode loaded
R
th(j-a)
thermal resistance from
junction to ambient
in free air
[1]
- - 500 K/W
R
th(j-t)
thermal resistance from
junction to tie-point
- - 360 K/W