SiHF18N50D
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Vishay Siliconix
S16-1602-Rev. B, 15-Aug-16
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Document Number: 91507
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Fig. 7 - Typical Source-Drain Diode Forward Voltage
Fig. 8 - Maximum Safe Operating Area
Fig. 9 - Maximum Drain Current vs. Case Temperature
Fig. 10 - Typical Drain-to-Source Voltage vs. Temperature
Fig. 11 - Normalized Thermal Transient Impedance, Junction-to-Case
ġ
ġ
ġ
ġ
ġ
ġ
ġ
0.1
1
10
100
0.2 0.4 0.6 0.8 1 1.2 1.4 1.6
T
J
= 150 °C
T
J
= 25 °C
V
GS
= 0 V
I
SD
, Reverse Drain Current (A)
V
SD
, Source-Drain Voltage (V)
0.1
1
10
100
1000
1 1 0 100 1000
Operation in this area
limited by R
DS(on)
Limited by R
DS(on)
*
100 μs
1 ms
10 ms
T
C
= 25 °C
T
J
= 150 °C
Single Pulse
BVDSS Limited
I
D
, Drain Current (A)
V
DS
, Drain-to-Source Voltage (V)
* V
GS
> minimum V
GS
at which R
DS(on)
is specied
4.0
8.0
12.0
16.0
20.0
25 50 75 100 125 150
I
D
, Drain Current (A)
T
J
, Case Temperature (°C)
ġ
ġ
ġ
ġ
ġ
ġ
ġ
475
500
525
550
575
600
625
- 60 0 160- 40 - 20 20 40 60 80 100 120 140
V
DS
, Drain-to-Source
Breakdown Voltage (V)
T
J
, Junction Temperature (°C)
0.01
0.1
1
0.0001 0.001 0.01 0.1 10
Normalized Effective Transient
Thermal Impedance
Pulse Time (s)
0.2
0.1
Duty Cycle = 0.5
0.05
0.02
Single Pulse
1